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Yosephine Andriani
Yosephine Andriani
Institute of Materials Research and Engineering
Verified email at imre.a-star.edu.sg
Title
Cited by
Cited by
Year
Structure–property relationships in biomedical thermoplastic polyurethane nanocomposites
AF Osman, GA Edwards, TL Schiller, Y Andriani, KS Jack, IC Morrow, ...
Macromolecules 45 (1), 198-210, 2012
1052012
Thermoplastic polyurethane (TPU)-based polymer nanocomposites
DJ Martin, AF Osman, Y Andriani, GA Edwards
Advances in Polymer Nanocomposites, 321-350, 2012
542012
In vitro biostability of poly (dimethyl siloxane/hexamethylene oxide)-based polyurethane/layered silicate nanocomposites
Y Andriani, IC Morrow, E Taran, GA Edwards, TL Schiller, AF Osman, ...
Acta biomaterialia 9 (9), 8308-8317, 2013
462013
Degradable Poly (alkyl acrylates) with Uniform Insertion of Ester Bonds, Comparing Batch and Semibatch Copolymerizations
JB Lena, AW Jackson, LR Chennamaneni, CT Wong, F Lim, Y Andriani, ...
Macromolecules 53 (10), 3994-4011, 2020
372020
Engineered nanofillers: impact on the morphology and properties of biomedical thermoplastic polyurethane nanocomposites
AF Osman, Y Andriani, GA Edwards, TL Schiller, KS Jack, IC Morrow, ...
RSC advances 2 (24), 9151-9164, 2012
352012
Green and efficient production of boron nitride nanosheets via oxygen doping-facilitated liquid exfoliation
Y Andriani, J Song, PC Lim, DHL Seng, DMY Lai, SL Teo, J Kong, ...
Ceramics International 45 (4), 4909-4917, 2019
262019
Wafer level warpage modelling and validation for FOWLP considering effects of viscoelastic material properties under process loadings
Z Chen, X Zhang, SPS Lim, SSB Lim, BL Lau, Y Han, MC Jong, S Liu, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1543-1549, 2019
132019
Organization of mixed dimethyldioctadecylammonium and choline modifiers on the surface of synthetic hectorite
Y Andriani, KS Jack, EP Gilbert, GA Edwards, TL Schiller, E Strounina, ...
Journal of colloid and interface science 409, 72-79, 2013
132013
Thermomechanical and viscoelastic properties of dielectric materials used in fan-out wafer-level packaging
Y Andriani, X Wang, S Liu, Z Chen, X Zhang
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 41-45, 2018
122018
Package level warpage simulation of fan-out wafer level package (FOWLP) considering viscoelastic material properties
Z Chen, X Zhang, SPS Lim, SSB Lim, BL Lau, Y Han, MC Jong, S Liu, ...
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 836-842, 2018
112018
Dynamic mechanical analysis and viscoelastic behavior of epoxy molding compounds used in fan-out wafer-level packaging
X Wang, Y Andriani, S Liu, Z Chen, X Zhang
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 585-590, 2018
112018
Effect of boron nitride nanosheets on properties of a commercial epoxy molding compound used in fan-out wafer-level packaging
Y Andriani, X Wang, DHL Seng, SL Teo, S Liu, BL Lau, X Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
92020
Solder Joint Reliability Simulation of Fan-out Wafer Level Package (FOWLP) Considering Viscoelastic Material Properties
Z Chen, X Zhang, SPS Lim, SSB Lim, BL Lau, Y Han, MC Jong, S Liu, ...
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 573-579, 2018
92018
Polyurethane acrylates as effective substrates for sustained in vitro culture of human myotubes
Y Andriani, JMW Chua, BYJ Chua, IY Phang, N Shyh-Chang, WS Tan
Acta biomaterialia 57, 115-126, 2017
92017
Advances in Polymer Nanocomposites
D Martin, A Osman, Y Andriani, GA Edwards
Types and Applications, 321-350, 2012
82012
Board level solder joint reliability design and analysis of FOWLP
X Zhang, BL Lau, H Chen, Y Han, MC Jong, SPS Lim, SSB Lim, X Wang, ...
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 316-320, 2020
72020
Selective interactions of glycidylamine epoxy/boron nitride nanosheets as a facile method to reinforce bisphenol-A epoxy resins
Y Andriani, J Song, DHL Seng, PC Lim, SL Teo, HK Hui, J Kong, X Wang, ...
Polymer 202, 122626, 2020
72020
Effect of thermal cycling on the thermal and mechanical properties of dielectric materials
X Wang, Y Andriani, PC Lim, CJJ Lee, S Liu, BL Lau, X Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
72020
Designing nanoporosity in a swollen polymer for the controlled release of a highly volatile fragrance
X Chen, A Bhardwaj, NSI Sharifah, L Zhang, SM Man, Y Andriani, WS Tan
Flavour And Fragrance Journal 34 (2), 124-132, 2019
52019
In-situ Cure Shrinkage Characterization of Epoxy Molding Compounds for Fan-Out Wafer-Level Packaging
X Wang, Y Andriani, S Liu, Z Chen, X Zhang
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 432-437, 2018
52018
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