| Structure–property relationships in biomedical thermoplastic polyurethane nanocomposites AF Osman, GA Edwards, TL Schiller, Y Andriani, KS Jack, IC Morrow, ... Macromolecules 45 (1), 198-210, 2012 | 105 | 2012 |
| Thermoplastic polyurethane (TPU)-based polymer nanocomposites DJ Martin, AF Osman, Y Andriani, GA Edwards Advances in Polymer Nanocomposites, 321-350, 2012 | 58 | 2012 |
| In vitro biostability of poly (dimethyl siloxane/hexamethylene oxide)-based polyurethane/layered silicate nanocomposites Y Andriani, IC Morrow, E Taran, GA Edwards, TL Schiller, AF Osman, ... Acta biomaterialia 9 (9), 8308-8317, 2013 | 45 | 2013 |
| Degradable Poly (alkyl acrylates) with Uniform Insertion of Ester Bonds, Comparing Batch and Semibatch Copolymerizations JB Lena, AW Jackson, LR Chennamaneni, CT Wong, F Lim, Y Andriani, ... Macromolecules 53 (10), 3994-4011, 2020 | 41 | 2020 |
| Engineered nanofillers: impact on the morphology and properties of biomedical thermoplastic polyurethane nanocomposites AF Osman, Y Andriani, GA Edwards, TL Schiller, KS Jack, IC Morrow, ... RSC advances 2 (24), 9151-9164, 2012 | 34 | 2012 |
| Green and efficient production of boron nitride nanosheets via oxygen doping-facilitated liquid exfoliation Y Andriani, J Song, PC Lim, DHL Seng, DMY Lai, SL Teo, J Kong, ... Ceramics International 45 (4), 4909-4917, 2019 | 26 | 2019 |
| Wafer level warpage modelling and validation for FOWLP considering effects of viscoelastic material properties under process loadings Z Chen, X Zhang, SPS Lim, SSB Lim, BL Lau, Y Han, MC Jong, S Liu, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1543-1549, 2019 | 16 | 2019 |
| Organization of mixed dimethyldioctadecylammonium and choline modifiers on the surface of synthetic hectorite Y Andriani, KS Jack, EP Gilbert, GA Edwards, TL Schiller, E Strounina, ... Journal of colloid and interface science 409, 72-79, 2013 | 13 | 2013 |
| Thermomechanical and viscoelastic properties of dielectric materials used in fan-out wafer-level packaging Y Andriani, X Wang, S Liu, Z Chen, X Zhang 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 41-45, 2018 | 12 | 2018 |
| Package level warpage simulation of fan-out wafer level package (FOWLP) considering viscoelastic material properties Z Chen, X Zhang, SPS Lim, SSB Lim, BL Lau, Y Han, MC Jong, S Liu, ... 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 836-842, 2018 | 11 | 2018 |
| Dynamic mechanical analysis and viscoelastic behavior of epoxy molding compounds used in fan-out wafer-level packaging X Wang, Y Andriani, S Liu, Z Chen, X Zhang 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 585-590, 2018 | 11 | 2018 |
| Effect of boron nitride nanosheets on properties of a commercial epoxy molding compound used in fan-out wafer-level packaging Y Andriani, X Wang, DHL Seng, SL Teo, S Liu, BL Lau, X Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 9 | 2020 |
| Solder Joint Reliability Simulation of Fan-out Wafer Level Package (FOWLP) Considering Viscoelastic Material Properties Z Chen, X Zhang, SPS Lim, SSB Lim, BL Lau, Y Han, MC Jong, S Liu, ... 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 573-579, 2018 | 9 | 2018 |
| Polyurethane acrylates as effective substrates for sustained in vitro culture of human myotubes Y Andriani, JMW Chua, BYJ Chua, IY Phang, N Shyh-Chang, WS Tan Acta biomaterialia 57, 115-126, 2017 | 9 | 2017 |
| Advances in Polymer Nanocomposites D Martin, A Osman, Y Andriani, GA Edwards Types and Applications, 321-350, 2012 | 9 | 2012 |
| Selective interactions of glycidylamine epoxy/boron nitride nanosheets as a facile method to reinforce bisphenol-A epoxy resins Y Andriani, J Song, DHL Seng, PC Lim, SL Teo, HK Hui, J Kong, X Wang, ... Polymer 202, 122626, 2020 | 8 | 2020 |
| Board level solder joint reliability design and analysis of FOWLP X Zhang, BL Lau, H Chen, Y Han, MC Jong, SPS Lim, SSB Lim, X Wang, ... 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 316-320, 2020 | 7 | 2020 |
| Effect of thermal cycling on the thermal and mechanical properties of dielectric materials X Wang, Y Andriani, PC Lim, CJJ Lee, S Liu, BL Lau, X Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 7 | 2020 |
| In-situ Cure Shrinkage Characterization of Epoxy Molding Compounds for Fan-Out Wafer-Level Packaging X Wang, Y Andriani, S Liu, Z Chen, X Zhang 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 432-437, 2018 | 6 | 2018 |
| Designing nanoporosity in a swollen polymer for the controlled release of a highly volatile fragrance X Chen, A Bhardwaj, NSI Sharifah, L Zhang, SM Man, Y Andriani, WS Tan Flavour And Fragrance Journal 34 (2), 124-132, 2019 | 5 | 2019 |
