| Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions JA Depiver, S Mallik, EH Amalu Engineering Failure Analysis 125, 105447, 2021 | 91 | 2021 |
| Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB) JA Depiver, S Mallik, EH Amalu Journal of Electronic Materials 50 (1), 263-282, 2021 | 56 | 2021 |
| Solder joint failures under thermo-mechanical loading conditions–A review J Depiver, S Mallik, D Harmanto Advances in Materials and Processing Technologies 7 (1), 1-26, 2021 | 54 | 2021 |
| Comparing and benchmarking fatigue behaviours of various SAC solders under thermo-mechanical loading JA Depiver, S Mallik, EH Amalu 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-11, 2020 | 16 | 2020 |
| Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing JA Depiver, S Mallik, D Harmanto, EH Amalu 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 143-153, 2019 | 12 | 2019 |
| Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB) JA Depiver, S Mallik, EH Amalu Proceedings of the World Congress on Engineering and Computer Science 2019, 1-9, 2019 | 12 | 2019 |
| Characterising solder materials from random vibration response of their interconnects in BGA packaging JA Depiver, S Mallik, EH Amalu Journal of Electronic Materials 52 (7), 4655-4671, 2023 | 10 | 2023 |
| Effect of creep, fatigue and random vibration on the integrity of solder joints in BGA package JA Depiver, S Mallik, EH Amalu Microelectronics Reliability 157, 115415, 2024 | 7 | 2024 |
| Creep Response of Various Solders used in Soldering Ball Grid Array (BGA) on Printed JA Depiver, S Mallik, EH Amalu IAENG 958, 2019 | 7 | 2019 |
| Experimental Analysis of Thin Layer Drying of Ginger Rhizome in Convective Environment GA Ikechukwu, S Mallik, JEE Njoku, J Depiver Advances in Science, Technology and Engineering Systems 5 (6), 1132-1142, 2020 | 6 | 2020 |
| Thermo-mechanical Reliability Studies of Lead-free Solder Interconnects JA Depiver University of Derby, 2021 | 5 | 2021 |
| An empirical study on convective drying of ginger rhizomes leveraging environmental stress chambers and linear heat conduction methodology JA Depiver, S Mallik Agriculture 13 (7), 1322, 2023 | 3 | 2023 |
| Temperature Distribution and Boundary Condition on Heat Transfer from Discretized Element of Dried Ginger Rhizome Using MATLAB PDES for Optimal Preservation AI Gbasouzor, J Depiver, JE Njoku Transactions on Engineering Technologies: World Congress on Engineering and …, 2020 | 1 | 2020 |
| Application of temperature distribution on discretized element of dried ginger using MATLAB PDES for optimal preservation GA Ikechukwu, J Depiver, JE Njoku Proceedings of the World Congress on Engineering and Computer Science 2, 2018 | 1 | 2018 |
| Time-dependent thixotropic behaviours of lead-free Sn-Ag-Cu (SAC) solder pastes and flux mediums used in electronic assemblies S Mallik, N Ekere, J Depiver David Publishing, 2025 | | 2025 |
| Impact of Thermomechanical Fatigue and Creep on the Reliability of BGA Lead-Free Solder Joints in Electronic Modules JA Depiver, S Mallik, EH Amalu 2024 IEEE 40th International Electronics Manufacturing Technology (IEMT), 1-7, 2024 | | 2024 |
| Comparative Analysis of SAC Solder Alloys for Enhanced Reliability in Electronic Assemblies: A Finite Element Approach J Depiver, S Mallik, EH Amalu | | 2024 |
| Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA) J Depiver, S Mallik, EH Amalu 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024 …, 2024 | | 2024 |
| Experimental Investigation of Convective Drying of Ginger Rhizomes Using the Environmental Stress Chambers and Linear Heat Conduction JA Depiver, S Mallik | | 2023 |
| Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications JA Depiver, S Mallik, Y Lu, EH Amalu Advances in Manufacturing Technology XXXIV 15, 187-197, 2021 | | 2021 |
Sabuj MallikProfessor & Head of School of Engineering & the Built Environment, Buckinghamshire New University UKVerified email at bucks.ac.uk
![Dr Emeka Amalu [BEng (Hons), MEng, PhD, PG Cert HE, CEng, MIMechE, MIET, FHEA]](https://scholar.googleusercontent.com/citations?view_op=small_photo&user=MVa79dgAAAAJ&citpid=2)
