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Co-authors
- Qi LiuFudan UniversityVerified email at ime.ac.cn
- Hangbing LvInstitute of Microelectronics, Chinese Academy of SciencesVerified email at ime.ac.cn
- Ming WangAssociate Professor, Fudan UniversityVerified email at fudan.edu.cn
- Wei WangScientist, Peng Cheng LaboratoryVerified email at pcl.ac.cn
- Shahar KvatinskyTechnion - Israel Institute of TechnologyVerified email at ee.technion.ac.il
- Daniele IelminiProfessor of ElectronicsVerified email at elet.polimi.it
- Qing LuoInstitute of Microelectronics, Chinese Academy of SciencesVerified email at ime.ac.cn
- Juan María García LastraTechnical University of DenmarkVerified email at dtu.dk
- Vincenzo EspositoTechnical University of DenmarkVerified email at dtu.dk
- Simone SannaUniversità degli Studi di Roma "Tor Vergata"Verified email at uniroma2.it
- Dennis Valbjørn ChristensenTechnical University of DenmarkVerified email at dtu.dk
- Lior KornblumViterbi Dept. of Electrical & Computer Engineering, Technion - Israel Institute of TechnologyVerified email at ee.technion.ac.il
- Marie TraulsenVerified email at dtu.dk
- Peng YaoTsinghua UniversityVerified email at mails.tsinghua.edu.cn
- J. Joshua YangUniversity of Southern California, Arthur B. Freeman Chair Professor, IEEE Fellow / NAI FellowVerified email at usc.edu
- Minhui ZouTechnion – Israel Institute of TechnologyVerified email at campus.technion.ac.il
- Y. Eren SuyolcuResearch Group Leader, Max Planck Institute for Solid StateVerified email at cornell.edu
- Peter A. van AkenProf. Dr.Verified email at fkf.mpg.de
- Eugen STAMATEDTU Nanolab, Technical University of DenmarkVerified email at dtu.dk
- Nini PrydsTechnical University of Denmark