| Interfacial reactions between lead-free solders and common base materials T Laurila, V Vuorinen, JK Kivilahti Materials Science and Engineering: R: Reports 49 (1-2), 1-60, 2005 | 1235 | 2005 |
| Thermodynamics, diffusion and the Kirkendall effect in solids A Paul, T Laurila, V Vuorinen, SV Divinski Springer International Publishing, 2014 | 435 | 2014 |
| Impurity and alloying effects on interfacial reaction layers in Pb-free soldering T Laurila, V Vuorinen, M Paulasto-Kröckel Materials Science and Engineering: R: Reports 68 (1-2), 1-38, 2010 | 362 | 2010 |
| Piezoelectric coefficients and spontaneous polarization of ScAlN MA Caro, S Zhang, T Riekkinen, M Ylilammi, MA Moram, ... Journal of Physics: Condensed Matter 27 (24), 245901, 2015 | 309 | 2015 |
| Cycle aging of commercial NMC/graphite pouch cells at different temperatures K Jalkanen, J Karppinen, L Skogström, T Laurila, M Nisula, K Vuorilehto Applied Energy 154, 160-172, 2015 | 278 | 2015 |
| Reactive sputter deposition and properties of TaxN thin films T Riekkinen, J Molarius, T Laurila, A Nurmela, I Suni, JK Kivilahti Microelectronic Engineering 64 (1-4), 289-297, 2002 | 218 | 2002 |
| Hybrid carbon based nanomaterials for electrochemical detection of biomolecules T Laurila, S Sainio, MA Caro Progress in Materials Science 88, 499-594, 2017 | 165 | 2017 |
| Growth Mechanism and Origin of High Content in Tetrahedral Amorphous Carbon MA Caro, VL Deringer, J Koskinen, T Laurila, G Csányi Physical review letters 120 (16), 166101, 2018 | 162 | 2018 |
| Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers T Laurila, J Hurtig, V Vuorinen, JK Kivilahti Microelectronics Reliability 49 (3), 242-247, 2009 | 128 | 2009 |
| Failure mechanism of Ta diffusion barrier between Cu and Si T Laurila, K Zeng, JK Kivilahti, J Molarius, I Suni Journal of Applied Physics 88 (6), 3377-3384, 2000 | 110 | 2000 |
| Micro-and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging: Volume I Materials physics-materials mechanics. Volume II Physical … E Suhir, YC Lee, CP Wong Springer, 2007 | 109 | 2007 |
| Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations V Vuorinen, H Yu, T Laurila, JK Kivilahti Journal of Electronic Materials 37, 792-805, 2008 | 107 | 2008 |
| Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests T Laurila, T Mattila, V Vuorinen, J Karppinen, J Li, M Sippola, JK Kivilahti Microelectronics Reliability 47 (7), 1135-1144, 2007 | 101 | 2007 |
| Electrochemical fouling of dopamine and recovery of carbon electrodes E Peltola, S Sainio, KB Holt, T Palomäki, J Koskinen, T Laurila Analytical chemistry 90 (2), 1408-1416, 2018 | 99 | 2018 |
| Solid-state reactions between Cu (Ni) alloys and Sn V Vuorinen, T Laurila, T Mattila, E Heikinheimo, JK Kivilahti Journal of Electronic Materials 36, 1355-1362, 2007 | 97 | 2007 |
| Heat generation in high power prismatic Li‐ion battery cell with LiMnNiCoO2 cathode material Y Abdul‐Quadir, T Laurila, J Karppinen, K Jalkanen, K Vuorilehto, ... International Journal of Energy Research 38 (11), 1424-1437, 2014 | 94 | 2014 |
| Reactivity of amorphous carbon surfaces: rationalizing the role of structural motifs in functionalization using machine learning MA Caro, A Aarva, VL Deringer, G Csányi, T Laurila Chemistry of Materials 30 (21), 7446-7455, 2018 | 92 | 2018 |
| Understanding X-ray spectroscopy of carbonaceous materials by combining experiments, density functional theory, and machine learning. Part I: Fingerprint spectra A Aarva, VL Deringer, S Sainio, T Laurila, MA Caro Chemistry of Materials 31 (22), 9243-9255, 2019 | 90 | 2019 |
| Tantalum carbide and nitride diffusion barriers for Cu metallisation T Laurila, K Zeng, JK Kivilahti, J Molarius, T Riekkinen, I Suni Microelectronic Engineering 60 (1-2), 71-80, 2002 | 86 | 2002 |
| Chemical stability of Ta diffusion barrier between Cu and Si T Laurila, K Zeng, JK Kivilahti, J Molarius, I Suni Thin Solid Films 373 (1-2), 64-67, 2000 | 86 | 2000 |
Vesa VuorinenAalto UniversityVerified email at tkk.fi
