| Electrodeposited Ag catalysts for the electrochemical reduction of CO2 to CO YS Ham, S Choe, MJ Kim, T Lim, SK Kim, JJ Kim Applied Catalysis B: Environmental 208, 35-43, 2017 | 142 | 2017 |
| Electrodeposited IrO2/Ti electrodes as durable and cost-effective anodes in high-temperature polymer-membrane-electrolyte water electrolyzers S Choe, BS Lee, MK Cho, HJ Kim, D Henkensmeier, SJ Yoo, JY Kim, ... Applied Catalysis B: Environmental 226, 289-294, 2018 | 82 | 2018 |
| Factors in electrode fabrication for performance enhancement of anion exchange membrane water electrolysis MK Cho, HY Park, S Choe, SJ Yoo, JY Kim, HJ Kim, D Henkensmeier, ... Journal of Power Sources 347, 283-290, 2017 | 66 | 2017 |
| Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums MJ Kim, Y Seo, HC Kim, Y Lee, S Choe, YG Kim, SK Cho, JJ Kim Electrochimica Acta 163, 174-181, 2015 | 60 | 2015 |
| Cu bottom-up filling for through silicon vias with growing surface established by the modulation of leveler and suppressor MJ Kim, HC Kim, S Choe, JY Cho, D Lee, I Jung, WS Cho, JJ Kim Journal of the Electrochemical Society 160 (12), D3221, 2013 | 56 | 2013 |
| Degradation of bis (3-sulfopropyl) disulfide and its influence on copper electrodeposition for feature filling S Choe, MJ Kim, HC Kim, SK Cho, SH Ahn, SK Kim, JJ Kim Journal of The Electrochemical Society 160 (12), D3179, 2013 | 54 | 2013 |
| An extremely low Pt loading cathode for a highly efficient proton exchange membrane water electrolyzer H Kim, S Choe, H Park, JH Jang, SH Ahn, SK Kim Nanoscale 9 (48), 19045-19049, 2017 | 43 | 2017 |
| Bottom-up filling of through silicon vias using galvanostatic Cu electrodeposition with the modified organic additives HC Kim, S Choe, JY Cho, D Lee, I Jung, WS Cho, MJ Kim, JJ Kim Journal of The Electrochemical Society 162 (3), D109, 2014 | 33 | 2014 |
| Electrodeposition of High-Surface-Area IrO2 Films on Ti Felt as an Efficient Catalyst for the Oxygen Evolution Reaction YJ Park, J Lee, YS Park, J Yang, MJ Jang, J Jeong, S Choe, JW Lee, ... Frontiers in Chemistry 8, 593272, 2020 | 30 | 2020 |
| Electrochemical behavior of citric acid and its influence on Cu electrodeposition for damascene metallization MJ Kim, S Choe, HC Kim, SK Cho, SK Kim, JJ Kim Journal of The Electrochemical Society 162 (8), D354, 2015 | 25 | 2015 |
| Direct fabrication of gas diffusion cathode by pulse electrodeposition for proton exchange membrane water electrolysis H Park, S Choe, H Kim, DK Kim, GH Cho, YS Park, JH Jang, DH Ha, ... Applied Surface Science 444, 303-311, 2018 | 24 | 2018 |
| Degradation of poly (ethylene glycol–propylene glycol) copolymer and its influences on copper electrodeposition S Choe, MJ Kim, HC Kim, T Lim, KJ Park, KH Kim, SH Ahn, A Lee, SK Kim, ... Journal of Electroanalytical Chemistry 714, 85-91, 2014 | 24 | 2014 |
| Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization HC Kim, MJ Kim, S Choe, T Lim, KJ Park, KH Kim, SH Ahn, SK Kim, ... Journal of The Electrochemical Society 161 (14), D749, 2014 | 19 | 2014 |
| Decomposition of polyethylene glycol (PEG) at Cu cathode and insoluble anode during Cu electrodeposition TY Kim, S Choe, JJ Kim Electrochimica Acta 357, 136803, 2020 | 18 | 2020 |
| Seed repair by electrodeposition in pyrophosphate solution for acid Cu superfilling S Choe, MJ Kim, HC Kim, T Lim, KJ Park, SK Cho, SK Kim, JJ Kim Journal of The Electrochemical Society 160 (4), D202, 2013 | 18 | 2013 |
| High strength Cu foil without self-annealing prepared by 2M5S-PEG-SPS A Lee, MJ Kim, S Choe, JJ Kim Korean Journal of Chemical Engineering 36, 981-987, 2019 | 16 | 2019 |
| High accuracy concentration analysis of accelerator components in acidic Cu superfilling bath S Choe, MJ Kim, KH Kim, HC Kim, Y Jeon, TY Kim, SK Kim, JJ Kim Journal of The Electrochemical Society 163 (2), D33, 2015 | 16 | 2015 |
| Selective determination of PEG-PPG concentration in Cu plating bath with cyclic voltammetry stripping using iodide ion Y Yoon, H Kim, TY Kim, KH Lee, S Choe, JJ Kim Electrochimica Acta 339, 135916, 2020 | 14 | 2020 |
| Electrodeposition of Cu-Ag films in ammonia-based electrolyte Y Jeon, S Choe, HC Kim, MJ Kim, JJ Kim Journal of Alloys and Compounds 775, 639-646, 2019 | 14 | 2019 |
| BOTTOM-UP FILLing of TSV-scaled trenches by using step current electrodeposition HC Kim, MJ Kim, Y Seo, Y Lee, S Choe, YG Kim, SK Cho, JJ Kim ECS Electrochemistry Letters 4 (10), D31, 2015 | 14 | 2015 |
