Donna Yost
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Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology
V Suntharalingam, R Berger, JA Burns, CK Chen, CL Keast, JM Knecht, ...
ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State …, 2005
A wafer-scale 3-D circuit integration technology
JA Burns, BF Aull, CK Chen, CL Chen, CL Keast, JM Knecht, ...
IEEE Transactions on Electron Devices 53 (10), 2507-2516, 2006
3D integrated superconducting qubits
D Rosenberg, D Kim, R Das, D Yost, S Gustavsson, D Hover, P Krantz, ...
npj quantum information 3 (1), 42, 2017
High-speed Schottky-barrier pMOSFET with f/sub T/= 280 GHz
M Fritze, CL Chen, S Calawa, D Yost, B Wheeler, P Wyatt, CL Keast, ...
IEEE Electron Device Letters 25 (4), 220-222, 2004
Laser radar imager based on 3D integration of Geiger-mode avalanche photodiodes with two SOI timing circuit layers
B Aull, J Burns, C Chen, B Felton, H Hanson, C Keast, J Knecht, A Loomis, ...
2006 IEEE International Solid State Circuits Conference-Digest of Technical …, 2006
Qubit and coupler circuit structures and coupling techniques
WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker
US Patent 10,134,972, 2018
100-nm node lithography with KrF?
M Fritze, B Tyrrell, DK Astolfi, D Yost, P Davis, B Wheeler, RD Mallen, ...
Optical Microlithography XIV 4346, 191-204, 2001
Solid-state qubits integrated with superconducting through-silicon vias
DRW Yost, ME Schwartz, J Mallek, D Rosenberg, C Stull, JL Yoder, ...
npj Quantum Information 6 (1), 59, 2020
Low-temperature oxide-bonded three-dimensional integrated circuits
Burns, Keast, Kunz, Lennon, Loomis, Mowers, Yost
2002 IEEE International SOI Conference, 123-124, 2002
Interconnect structures and methods for fabricating interconnect structures
WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker
US Patent 10,121,754, 2018
High-performance fully-depleted SOI RF CMOS
CL Chen, SJ Spector, RM Blumgold, RA Neidhard, WT Beard, DR Yost, ...
IEEE Electron Device Letters 23 (1), 52-54, 2002
Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker
US Patent 10,396,269, 2019
Subwavelength optical lithography with phase-shift photomasks
M Fritze, BM Tyrrell, DK Astolfi, RD Lambert, DRW Yost, AR Forte, ...
Lincoln Laboratory Journal 14 (2), 237-250, 2003
Solid-state qubits: 3D integration and packaging
D Rosenberg, SJ Weber, D Conway, DRW Yost, J Mallek, G Calusine, ...
IEEE Microwave Magazine 21 (8), 72-85, 2020
Low polarization dependent diffraction grating for wavelength demultimlexing
E Popov, J Hoose, B Frankel, C Keast, M Fritze, TY Fan, D Yost, S Rabe
Optics Express 12 (2), 269-275, 2004
Cryogenic qubit integration for quantum computing
RN Das, JL Yoder, D Rosenberg, DK Kim, D Yost, J Mallek, D Hover, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 504-514, 2018
Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits
CL Chen, DR Yost, JM Knecht, DC Chapman, DC Oakley, LJ Mahoney, ...
2009 IEEE International Conference on 3D System Integration, 1-4, 2009
Gratings of regular arrays and trim exposures for ultralarge scale integrated circuit phase-shift lithography
M Fritze, B Tyrrell, D Astolfi, D Yost, P Davis, B Wheeler, R Mallen, ...
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2001
Thermal effects of three dimensional integrated circuit stacks
CL Chen, CK Chen, JA Burns, DR Yost, K Warner, JM Knecht, PW Wyatt, ...
2007 IEEE International SOI Conference, 91-92, 2007
Three-dimensional integration of silicon-on-insulator RF amplifier
CL Chen, CK Chen, DR Yost, JM Knecht, PW Wyatt, JA Burns, K Warner, ...
Electronics Letters 44 (12), 746, 2008
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