| Prognostic and health management for engineering systems: a review of the data‐driven approach and algorithms T Sutharssan, S Stoyanov, C Bailey, C Yin The Journal of engineering 2015 (7), 215-222, 2015 | 125 | 2015 |
| A review of data-driven prognostics in power electronics A Kabir, C Bailey, H Lu, S Stoyanov 2012 35th International Spring Seminar on Electronics Technology, 189-192, 2012 | 49 | 2012 |
| Prognostics and health monitoring of high power LED T Sutharssan, S Stoyanov, C Bailey, Y Rosunally Micromachines 3 (1), 78-100, 2012 | 44 | 2012 |
| Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process RW Kay, S Stoyanov, GP Glinski, C Bailey, MPY Desmulliez IEEE Transactions on Components and packaging technologies 30 (1), 129-136, 2007 | 41 | 2007 |
| A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints Y Xu, J Xian, S Stoyanov, C Bailey, RJ Coyle, CM Gourlay, FPE Dunne International Journal of Plasticity 155, 103308, 2022 | 38 | 2022 |
| Design, manufacture and test for reliable 3D printed electronics packaging T Tilford, S Stoyanov, J Braun, JC Janhsen, M Burgard, R Birch, C Bailey Microelectronics Reliability 85, 109-117, 2018 | 38 | 2018 |
| Machine learning for additive manufacturing of electronics S Stoyanov, C Bailey 2017 40th international spring seminar on electronics technology (ISSE), 1-6, 2017 | 38 | 2017 |
| Data driven prognostics for predicting remaining useful life of IGBT M Ahsan, S Stoyanov, C Bailey 2016 39th International Spring Seminar on Electronics Technology (ISSE), 273-278, 2016 | 33 | 2016 |
| Data driven approach to quality assessment of 3D printed electronic products G Tourloukis, S Stoyanov, T Tilford, C Bailey 2015 38th International spring seminar on electronics technology (ISSE), 300-305, 2015 | 31 | 2015 |
| Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging S Stoyanov, C Bailey, M Desmulliez Soldering & Surface Mount Technology 21 (1), 11-24, 2009 | 28 | 2009 |
| Modelling and prototyping the conceptual design of 3D CMM micro-probe S Stoyanov, C Bailey, R Leach, B Hughes, A Wilson, W O'Neill, RA Dorey, ... 2008 2nd Electronics System-Integration Technology Conference, 193-198, 2008 | 23 | 2008 |
| Optimisation modelling for flip‐chip solder joint reliability S Stoyanov, C Bailey, M Cross Soldering & surface mount technology 14 (1), 49-58, 2002 | 23 | 2002 |
| Predictive analytics methodology for smart qualification testing of electronic components S Stoyanov, M Ahsan, C Bailey, T Wotherspoon, C Hunt Journal of Intelligent Manufacturing 30 (3), 1497-1514, 2019 | 20 | 2019 |
| 3D-printing and electronic packaging C Bailey, S Stoyanov, T Tilford, G Tourloukis 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-7, 2016 | 18 | 2016 |
| Prognostics and reliability assessment of light emitting diode packaging T Sutharssan, C Bailey, S Stoyanov, Y Rosunally 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 18 | 2011 |
| Fusion approach for prognostics framework of heritage structure YZ Rosunally, S Stoyanov, C Bailey, P Mason, S Campbell, G Monger, ... IEEE Transactions on Reliability 60 (1), 3-13, 2011 | 18 | 2011 |
| Modelling methodology for thermal analysis of hot solder dip process S Stoyanov, C Bailey, MO Alam, C Yin, C Best, P Tollafield, R Crawford, ... Microelectronics Reliability 53 (8), 1055-1067, 2013 | 17 | 2013 |
| No-flow underfill flip chip assembly––an experimental and modeling analysis H Lu, KC Hung, S Stoyanov, C Bailey, YC Chan Microelectronics Reliability 42 (8), 1205-1212, 2002 | 17 | 2002 |
| Prognostics of automotive electronics with data driven approach: A review M Ahsan, S Stoyanov, C Bailey 2016 39th International Spring Seminar on Electronics Technology (ISSE), 279-284, 2016 | 16 | 2016 |
| Solder joint reliability optimization S Stoyanov, C Bailey, H Lu, M Cross APACK 2001, Conference on advances in packages, 178-186, 2001 | 16 | 2001 |
Chris BaileyArizona State UniversityVerified email at asu.edu
