| Microstructure characteristics and phase transformations of the Ni-P and Ni-P-Re electroless deposited coatings after heat treatment J Wojewoda-Budka, A Wierzbicka-Miernik, L Litynska-Dobrzynska, ... Electrochimica Acta 209, 183-191, 2016 | 55 | 2016 |
| A novel hybrid composites based on biopolyamide 10.10 with basalt/aramid fibers: Mechanical and thermal investigation P Bazan, P Nosal, A Wierzbicka-Miernik, S Kuciel Composites Part B: Engineering 223, 109125, 2021 | 42 | 2021 |
| Formation of a quasicrystalline phase in Al–Mn base alloys cast at intermediate cooling rates K Stan-Głowińska, Ł Rogal, A Góral, A Wierzbicka-Miernik, ... Journal of Materials Science 52, 7794-7807, 2017 | 34 | 2017 |
| Corrosion behavior of lead-free SAC-type solder alloys in liquid media A Wierzbicka-Miernik, J Guspiel, L Zabdyr Archives of Civil and Mechanical Engineering 15 (1), 206-213, 2015 | 34 | 2015 |
| Microstructural and phase composition differences across the interfaces in Al/Ti/Al explosively welded clads DM Fronczek, R Chulist, L Litynska-Dobrzynska, GA Lopez, ... Metallurgical and Materials Transactions A 48, 4154-4165, 2017 | 27 | 2017 |
| Electroless deposition of Ni–P and Ni–P–Re alloys from acidic hypophosphite baths H Kazimierczak, A Wierzbicka-Miernik, I Kwiecien, MJ Szczerba, ... Electrochimica Acta 303, 157-166, 2019 | 23 | 2019 |
| Microstructure and chemical characterization of the intermetallic phases in Cu/(Sn, Ni) diffusion couples with various Ni additions A Wierzbicka-Miernik, K Miernik, J Wojewoda-Budka, ... Intermetallics 59, 23-31, 2015 | 21 | 2015 |
| Grain boundary wetting and premelting in the Cu–Co alloys BB Straumal, A Korneva, O Kogtenkova, L Kurmanaeva, P Zięba, ... Journal of alloys and compounds 615, S183-S187, 2014 | 21 | 2014 |
| Growth kinetics of the intermetallic phase in diffusion-soldered (Cu–5 at.% Ni)/Sn/(Cu–5 at.% Ni) interconnections A Wierzbicka-Miernik, K Miernik, J Wojewoda-Budka, K Szyszkiewicz, ... Materials Chemistry and Physics 142 (2-3), 682-685, 2013 | 20 | 2013 |
| Growth kinetics of the selected intermetallic phases in Ni/Al/Ni system with various nickel substrate microstructure I Kwiecien, P Bobrowski, A Wierzbicka-Miernik, L Litynska-Dobrzynska, ... Nanomaterials 9 (2), 134, 2019 | 18 | 2019 |
| The effect of Re addition on the thermal stability and structure of Ni–P electroless coatings J Wojewoda-Budka, A Wierzbicka-Miernik, M Szczerba, H Kazimierczak, ... Materials Characterization 171, 110811, 2021 | 15 | 2021 |
| Morphology and chemical composition of Cu/Sn/Cu and Cu (5 at-% Ni)/Sn/Cu (5 at-% Ni) interconnections A Wierzbicka-Miernik, J Wojewoda-Budka, L Litynska-Dobrzynska, ... Science and Technology of Welding and Joining 17 (1), 32-35, 2012 | 15 | 2012 |
| Influence of phosphorous content on microstructure development at the Ni-P plating/SAC interface Z Huber, J Wojewoda-Budka, A Wierzbicka-Miernik, A Sypien, ... Electronic Materials Letters 12, 178-185, 2016 | 13 | 2016 |
| Formation of magnesium silicide in bulk diffusion couples A Kodentsov, A Wierzbicka-Miernik, L Litynska-Dobrzynska, P Czaja, ... Intermetallics 114, 106589, 2019 | 12 | 2019 |
| Grain boundary complexions and phase transformations in Al-and Cu-based alloys O Kogtenkova, B Straumal, A Korneva, T Czeppe, A Wierzbicka-Miernik, ... Metals 9 (1), 10, 2018 | 12 | 2018 |
| Kinetics of intermetallic phase growth and determination of diffusion coefficients in solid–solid-state reaction between Cu and (Sn+ 1at.% Ni) pads A Wierzbicka-Miernik, K Miernik, R Filipek, K Szyszkiewicz Journal of Materials Science 52, 10533-10544, 2017 | 12 | 2017 |
| The α↔ ω phase transformations and thermal stability of TiCo alloy treated by high pressure torsion A Korneva, BB Straumal, AR Kilmametov, A Wierzbicka-Miernik, ... Materials Characterization 173, 110937, 2021 | 11 | 2021 |
| Composition dependence of martensitic transformation and crystal structure in Ni50Mn25Ga25-xCux Heusler alloys A Brzoza, A Wierzbicka-Miernik, T Czeppe, E Cesari, MJ Szczerba Intermetallics 109, 157-161, 2019 | 11 | 2019 |
| The intermetallics growth at the interface of explosively welded A1050/Ti gr. 2/A1050 clads in relation to the explosive material DM Fronczek, A Wierzbicka-Miernik, K Saksl, K Miernik, R Chulist, ... Archives of Civil and Mechanical Engineering 18 (4), 1679-1685, 2018 | 11 | 2018 |
| Formation of intermetallic compounds in reaction between Cu–Ni alloys and solid Sn–a new look at the prominent effect of Ni A Kodentsov, J Wojewoda-Budka, L Litynska-Dobrzynska, P Zieba, ... Journal of Alloys and Compounds 858, 157677, 2021 | 10 | 2021 |
