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Co-authors
- Gerbrand CederProfessor of Materials Science and EngineeringVerified email at berkeley.edu
- Anubhav JainLawrence Berkeley National LabVerified email at lbl.gov
- Kristin Aslaug Persson (nee Einarsdott...Department of Materials Science and Engineering, UC BerkeleyVerified email at berkeley.edu
- John DagdelenDoctorate, University of California, BerkeleyVerified email at berkeley.edu
- Leigh WestonLawrence Berkeley National LaboratoryVerified email at engineering.ucsb.edu
- A. J. FergusonMicron Cubed SimulationsVerified email at microncubed.com
- Dr. A.P. MihaiLomare Technologies/Imperial CollegeVerified email at lomaretech.com
- Andy IrvineCavendish Laboratory, University of CambridgeVerified email at cam.ac.uk
- Jacob GaylesAssistant Professor, Department of Physics University of South FloridaVerified email at usf.edu
- Jakub ZeleznyInstitute of Physics of the Czech Academy of SciencesVerified email at fzu.cz
- Frank FreimuthPostdoc, Forschungszentrum JülichVerified email at fz-juelich.de
- Jairo SinovaJohannes Gutenberg UniversitätVerified email at uni-mainz.de
- Zhe YuanFudan UniversityVerified email at fudan.edu.cn
- Laurens W MolenkampPhysics Institute (EP3) and Institute for Topological Insulators, Würzburg UniversityVerified email at physik.uni-wuerzburg.de
- Yves CapdeboscqLaboratoire Jacques-Louis Lions, Université Paris CitéVerified email at u-paris.fr
- Peter WadleyThe University of NottinghamVerified email at nottingham.ac.uk
- Mu WangEmberion Ltd.Verified email at emberion.com
- Andrew RushforthSchool of Physics and Astronomy, University of Nottingham, UKVerified email at nottingham.ac.uk