Follow
David A. Hutt
Title
Cited by
Cited by
Year
Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
JF Li, SH Mannan, MP Clode, DC Whalley, DA Hutt
Acta materialia 54 (11), 2907-2922, 2006
2262006
Influence of adsorbate ordering on rates of UV photooxidation of self-assembled monolayers
DA Hutt, GJ Leggett
The Journal of Physical Chemistry 100 (16), 6657-6662, 1996
2081996
Structure and mechanism of photooxidation of self-assembled monolayers of alkylthiols on silver studied by XPS and static SIMS
DA Hutt, E Cooper, GJ Leggett
The Journal of Physical Chemistry B 102 (1), 174-184, 1998
1501998
Oxidation protection of copper surfaces using self-assembled monolayers of octadecanethiol
DA Hutt, C Liu
Applied surface science 252 (2), 400-411, 2005
1372005
Functionalization of hydroxyl and carboxylic acid terminated self-assembled monolayers
DA Hutt, GJ Leggett
Langmuir 13 (10), 2740-2748, 1997
1101997
Rates of attachment of fibroblasts to self-assembled monolayers formed by the adsorption of alkylthiols onto gold surfaces
DA Hutt, TL Parker
Journal of Materials Chemistry 7 (3), 435-441, 1997
831997
Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation
DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan
IEEE transactions on components and packaging technologies 25 (1), 87-97, 2002
732002
Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders
JF Li, SH Mannan, MP Clode, K Chen, DC Whalley, C Liu, DA Hutt
Acta materialia 55 (2), 737-752, 2007
682007
Application of adhesives in MEMS and MOEMS assembly: a review
F Sarvar, DA Hutt, DC Whalley
2nd International IEEE Conference on Polymers and Adhesives in …, 2002
682002
Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate
X Cui, DA Hutt, PP Conway
Thin Solid Films 520 (19), 6095-6099, 2012
602012
Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation
JE Graves, M Sugden, RE Litchfield, DA Hutt, TJ Mason, AJ Cobley
Ultrasonics sonochemistry 29, 428-438, 2016
442016
The Evolution of Pd∕ Sn Catalytic Surfaces in Electroless Copper Deposition
X Cui, DA Hutt, DJ Scurr, PP Conway
Journal of the Electrochemical Society 158 (3), D172-D177, 2011
432011
Electrodeposition of indium for bump bonding
Y Tian, C Liu, D Hutt, B Stevens
2008 58th Electronic Components and Technology Conference, 2096-2100, 2008
392008
Fluxless soldering of copper substrates using self-assembled monolayers for preservation
C Liu, DA Hutt
IEEE transactions on components and packaging technologies 29 (3), 512-521, 2006
382006
Static secondary ion mass spectrometry studies of self-assembled monolayers: electron beam degradation of alkanethiols on gold
DA Hutt, GJ Leggett
Journal of materials chemistry 9 (4), 923-928, 1999
371999
Megasonic agitation for enhanced electrodeposition of copper
JG Kaufmann, MPY Desmulliez, Y Tian, D Price, M Hughes, N Strusevich, ...
Microsystem technologies 15 (8), 1245-1254, 2009
332009
Desorption of butanethiol from Au (111) during storage in ultrahigh vacuum: Effects on surface coverage and stability toward displacement by solution-phase thiols
DA Hutt, GJ Leggett
Langmuir 13 (11), 3055-3058, 1997
321997
Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating
DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan
IEEE transactions on components and packaging technologies 25 (1), 98-105, 2002
312002
A SEXAFS investigation of self-assembled monolayers on silver
DA Hutt, E Cooper, GJ Leggett
Surface science 397 (1-3), 154-163, 1998
311998
Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures
S Hou, S Qi, DA Hutt, JR Tyrer, M Mu, Z Zhou
Journal of Materials Processing Technology 254, 310-324, 2018
302018
The system can't perform the operation now. Try again later.
Articles 1–20