David A. Hutt
Title
Cited by
Cited by
Year
Influence of adsorbate ordering on rates of UV photooxidation of self-assembled monolayers
DA Hutt, GJ Leggett
The Journal of Physical Chemistry 100 (16), 6657-6662, 1996
1921996
Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
JF Li, SH Mannan, MP Clode, DC Whalley, DA Hutt
Acta materialia 54 (11), 2907-2922, 2006
1702006
Structure and mechanism of photooxidation of self-assembled monolayers of alkylthiols on silver studied by XPS and static SIMS
DA Hutt, E Cooper, GJ Leggett
The Journal of Physical Chemistry B 102 (1), 174-184, 1998
1391998
Oxidation protection of copper surfaces using self-assembled monolayers of octadecanethiol
DA Hutt, C Liu
Applied surface science 252 (2), 400-411, 2005
1232005
Functionalization of hydroxyl and carboxylic acid terminated self-assembled monolayers
DA Hutt, GJ Leggett
Langmuir 13 (10), 2740-2748, 1997
981997
Rates of attachment of fibroblasts to self-assembled monolayers formed by the adsorption of alkylthiols onto gold surfaces
DA Hutt, TL Parker
Journal of Materials Chemistry 7 (3), 435-441, 1997
771997
Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation
DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan
IEEE transactions on components and packaging technologies 25 (1), 87-97, 2002
652002
Application of adhesives in MEMS and MOEMS assembly: a review
F Sarvar, DA Hutt, DC Whalley
2nd International IEEE Conference on Polymers and Adhesives in …, 2002
612002
Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders
JF Li, SH Mannan, MP Clode, K Chen, DC Whalley, C Liu, DA Hutt
Acta materialia 55 (2), 737-752, 2007
582007
Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate
X Cui, DA Hutt, PP Conway
Thin Solid Films 520 (19), 6095-6099, 2012
382012
Static secondary ion mass spectrometry studies of self-assembled monolayers: electron beam degradation of alkanethiols on gold
DA Hutt, GJ Leggett
Journal of materials chemistry 9 (4), 923-928, 1999
351999
The Evolution of Pd∕ Sn Catalytic Surfaces in Electroless Copper Deposition
X Cui, DA Hutt, DJ Scurr, PP Conway
Journal of the Electrochemical Society 158 (3), D172-D177, 2011
322011
Electrodeposition of indium for bump bonding
Y Tian, C Liu, D Hutt, B Stevens
2008 58th Electronic Components and Technology Conference, 2096-2100, 2008
322008
A SEXAFS investigation of self-assembled monolayers on silver
DA Hutt, E Cooper, GJ Leggett
Surface science 397 (1-3), 154-163, 1998
311998
Desorption of butanethiol from Au (111) during storage in ultrahigh vacuum: Effects on surface coverage and stability toward displacement by solution-phase thiols
DA Hutt, GJ Leggett
Langmuir 13 (11), 3055-3058, 1997
311997
Megasonic agitation for enhanced electrodeposition of copper
JG Kaufmann, MPY Desmulliez, Y Tian, D Price, M Hughes, N Strusevich, ...
Microsystem technologies 15 (8), 1245-1254, 2009
272009
A comparative study of the interfacial reaction between electroless Ni–P coatings and molten tin
K Chen, C Liu, DC Whalley, DA Hutt, JF Li, SH Mannan
Acta Materialia 56 (19), 5668-5676, 2008
272008
Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation
JE Graves, M Sugden, RE Litchfield, DA Hutt, TJ Mason, AJ Cobley
Ultrasonics sonochemistry 29, 428-438, 2016
262016
Fluxless soldering of copper substrates using self-assembled monolayers for preservation
C Liu, DA Hutt
IEEE transactions on components and packaging technologies 29 (3), 512-521, 2006
262006
Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating
DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan
IEEE transactions on components and packaging technologies 25 (1), 98-105, 2002
262002
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