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Bahgat G Sammakia
Bahgat G Sammakia
Verified email at binghamton.edu - Homepage
Title
Cited by
Cited by
Year
Buoyancy-induced flows and transport
B Gebhart
Hemisphere Pub, 1988
19151988
Thermal challenges in next-generation electronic systems
SV Garimella, AS Fleischer, JY Murthy, A Keshavarzi, R Prasher, C Patel, ...
IEEE Transactions on Components and Packaging Technologies 31 (4), 801-815, 2008
4962008
Bending fatigue study of sputtered ITO on flexible substrate
K Alzoubi, MM Hamasha, S Lu, B Sammakia
Journal of Display Technology 7 (11), 593-600, 2011
2402011
Pluggable electronic circuit package assembly with snap together heat sink housing
J Funari, TC Godown, SD Reynolds, BG Sammakia
US Patent 5,109,318, 1992
1621992
Electronic package with heat spreader member
M Anschel, BG Sammakia
US Patent 4,914,551, 1990
1471990
A review of recent developments in some practical aspects of air-cooled electronic packages
S Sathe, B Sammakia
1421998
Comparative analysis of different data center airflow management configurations
S Shrivastava, B Sammakia, R Schmidt, M Iyengar
International Electronic Packaging Technical Conference and Exhibition 42002 …, 2005
1222005
A brief overview of recent developments in thermal management in data centers
S Alkharabsheh, J Fernandes, B Gebrehiwot, D Agonafer, K Ghose, ...
Journal of Electronic Packaging 137 (4), 040801, 2015
1202015
Experimental-numerical comparison for a high-density data center: Hot spot heat fluxes in excess of 500 W/ft2
SK Shrivastava, BG Sammakia, R Schmidt, M Iyengar, JW VanGilder
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
1092006
Thermal challenges in next generation electronic systems-summary of panel presentations and discussions
SV Garimella, YK Joshi, A Bar-Cohen, R Mahajan, KC Toh, VP Carey, ...
IEEE Transactions on Components and Packaging Technologies 25 (4), 569-575, 2002
1042002
Method and apparatus for testing of integrated circuit chips
M Anschel, AP Ingraham, CR Lamb, MD Lowell, VR Markovich, W Mayr, ...
US Patent 5,420,520, 1995
1011995
Optimization of data center room layout to minimize rack inlet air temperature
S Bhopte, D Agonafer, R Schmidt, B Sammakia
1002006
A review of recent advances in thermal management in three dimensional chip stacks in electronic systems
V Venkatadri, B Sammakia, K Srihari, D Santos
962011
Electronic package having active means to maintain its operating temperature constant
LSW Mok, S Purushothaman, BG Sammakia, JS Wilczynski, TY Wu
US Patent 5,491,610, 1996
921996
Electronic package with improved heat sink
J Funari, MC Green, SD Reynolds, BG Sammakia
US Patent 4,849,856, 1989
911989
Estimating thermal conductivity of amorphous silica nanoparticles and nanowires using molecular dynamics simulations
SS Mahajan, G Subbarayan, BG Sammakia
Physical Review E 76 (5), 056701, 2007
812007
Flexible chemiresistor sensors: Thin film assemblies of nanoparticles on a polyethylene terephthalate substrate
L Wang, J Luo, J Yin, H Zhang, J Wu, X Shi, E Crew, Z Xu, Q Rendeng, ...
Journal of Materials Chemistry 20 (5), 907-915, 2010
802010
An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials
S Kanuparthi, G Subbarayan, T Siegmund, B Sammakia
IEEE Transactions on Components and Packaging Technologies 31 (3), 611-621, 2008
672008
Predictive model for optimized design parameters in flip-chip packages and assemblies
S Park, HC Lee, B Sammakia, K Raghunathan
IEEE Transactions on Components and Packaging Technologies 30 (2), 294-301, 2007
662007
Three-objective shape optimization and parametric study of a micro-channel heat sink with discrete non-uniform heat flux boundary conditions
Y Hadad, B Ramakrishnan, R Pejman, S Rangarajan, PR Chiarot, ...
Applied Thermal Engineering 150, 720-737, 2019
652019
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