| Nanomanufacturing of silicon surface with a single atomic layer precision via mechanochemical reactions L Chen, J Wen, P Zhang, B Yu, C Chen, T Ma, X Lu, SH Kim, L Qian Nature communications 9 (1), 1542, 2018 | 171 | 2018 |
| Atomic insight into tribochemical wear mechanism of silicon at the Si/SiO2 interface in aqueous environment: molecular dynamics simulations using ReaxFF reactive force field J Wen, T Ma, W Zhang, G Psofogiannakis, ACT van Duin, L Chen, L Qian, ... Applied Surface Science 390, 216-223, 2016 | 105 | 2016 |
| Atomistic mechanisms of Si chemical mechanical polishing in aqueous H2O2: ReaxFF reactive molecular dynamics simulations J Wen, T Ma, W Zhang, ACT van Duin, X Lu Computational Materials Science 131, 230-238, 2017 | 86 | 2017 |
| Atomistic Insights into Cu Chemical Mechanical Polishing Mechanism in Aqueous Hydrogen Peroxide and Glycine: ReaxFF Reactive Molecular Dynamics Simulations J Wen, T Ma, W Zhang, ACT van Duin, DM van Duin, Y Hu, X Lu The Journal of Physical Chemistry C, 2019 | 37 | 2019 |
| Surface Orientation and Temperature Effects on the Interaction of Silicon with Water: Molecular Dynamics Simulations Using ReaxFF Reactive Force Field J Wen, T Ma, W Zhang, ACT Van Duin, X Lu The Journal of Physical Chemistry A 121 (3), 587-594, 2017 | 28 | 2017 |
| Numerical investigation of wafer drying induced by the thermal Marangoni effect C Li, D Zhao, J Wen, X Lu International Journal of Heat and Mass Transfer 132, 689-698, 2019 | 18 | 2019 |
| Evolution of entrained water film thickness and dynamics of Marangoni flow in Marangoni drying C Li, D Zhao, J Wen, J Cheng, X Lu RSC Advances 8 (9), 4995-5004, 2018 | 14 | 2018 |
| Atomic Insights into Material Removal Mechanisms in Si and Cu Chemical Mechanical Polishing Processes: ReaxFF Reactive Molecular Dynamics Simulations J Wen, T Ma, X Lu, W Zhang, ACT van Duin ICPT 2017; International Conference on Planarization/CMP Technology, 1-3, 2017 | 2 | 2017 |
| Reactive molecular dynamics simulation of Si chemical mechanical polishing process J Wen, X Lu 2015 International Conference on Planarization/CMP Technology (ICPT), 1-4, 0 | | |
