| Multi-objective optimization for silicon wafer slicing using wire-EDM process G Dongre, S Zaware, U Dabade, SS Joshi Materials Science in Semiconductor Processing 39, 793-806, 2015 | 55 | 2015 |
| Laser micro & nano surface texturing for enhancing osseointegration and antimicrobial effect of biomaterials: A review N Sirdeshmukh, G Dongre Materials Today: Proceedings 44, 2348-2355, 2021 | 46 | 2021 |
| Surface integrity investigation including grinding burns using barkhausen noise (BNA) A Thanedar, GG Dongre, R Singh, SS Joshi Journal of Manufacturing Processes 30, 226-240, 2017 | 33 | 2017 |
| Response surface analysis of slicing of silicon ingots with focus on photovoltaic application G Dongre, R Singh, SS Joshi Machining science and technology 16 (4), 624-652, 2012 | 22 | 2012 |
| Analytical modelling of temperature in cylindrical grinding to predict grinding burns A Thanedar, GG Dongre, SS Joshi International Journal of Precision Engineering and Manufacturing 20, 13-25, 2019 | 21 | 2019 |
| Preparation of super-hydrophobic textures by using nanosecond pulsed laser G Dongre, A Rajurkar, R Raut, S Jangam Materials Today: Proceedings 42, 1145-1151, 2021 | 18 | 2021 |
| Efficient dicing of silicon ingots for photovoltaic applications C Vesvikar, RK Singh, SS Joshi 2010 35th IEEE Photovoltaic Specialists Conference, 003629-003634, 2010 | 16 | 2010 |
| Analytical modeling of exit Burr in drilling of Ti6Al4V alloy A Rana, G Dongre, SS Joshi Sādhanā 44, 1-19, 2019 | 11 | 2019 |
| Modeling of silicon ingot slicing process by wire–electrical discharge machining GG Dongre, C Vesivkar, R Singh, SS Joshi Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2013 | 11 | 2013 |
| Achieving controlled topography and wettability through laser surface texturing of Ti6Al4V for bioengineering applications N Sirdeshmukh, G Dongre Results in Engineering 17, 100898, 2023 | 10 | 2023 |
| Set-up time reduction of a manufacturing line using SMED technique R Gavali, S Chavan, GG Dongre International Research Journal of Engineering and Technology 3 (7), 1748-1750, 2016 | 8 | 2016 |
| IoT based smart plant monitoring system MK Kumar, H Krishna Int. J. Adv. Res. Sci. Eng 7, 409-413, 2018 | 7 | 2018 |
| Numerical modelling of wire-EDM for predicting erosion rate of silicon K Joshi, G Sharma, G Dongre, SS Joshi Journal of The Institution of Engineers (India): Series C 98, 63-73, 2017 | 7 | 2017 |
| Removal of surface spatter and recast layer by chemical cleaning G Dongre, A Rajurkar, R Gondil, A Mamidwar, J Philip Materials Today: Proceedings 18, 4763-4772, 2019 | 5 | 2019 |
| Analysis for machining of Ti6Al4V alloy using coated and non-coated carbide tools G Dongre, J Shaikh, L Dhakad, A Rajurkar, P Gaigole International Conference on Communication and Signal Processing 2016 (ICCASP …, 2016 | 4 | 2016 |
| Modeling of wire EDM slicing process for silicon K Joshi, G Sharma, G Dongre, SS Joshi 5th International and 26th all India manufacturing technology, design and …, 2014 | 4 | 2014 |
| Effect of cooling technique and tool material on Ti6Al4V alloy G Dongre, A Rajurkar, S Patil, R Raut, N Joseph, V Mote, H Raja, ... Materials Today: Proceedings 80, 1567-1572, 2023 | 3 | 2023 |
| Seamless optimized LTE based mobile polar decoder configuration for efficient system integration, higher capacity, and extended signal coverage MM Jadhav, GG Dongre, AM Sapkal International Journal of Applied Metaheuristic Computing (IJAMC) 10 (3), 68-90, 2019 | 3 | 2019 |
| High aspects ratio micro-drilling of super-alloys using ultra short pulsed laser GG Dongre, A Rajurkar, R Gondil, J Philip International Journal of Precision Technology 8 (2-4), 124-141, 2019 | 3 | 2019 |
| Thermal modelling for laser machining of SS316 L, inconel 718 and Ti6Al4V G Dongre, A Rajurkar, A Haria, A Kulkarni, R Raut Journal of Physics: Conference Series 2070 (1), 012226, 2021 | 2 | 2021 |
