| Heterogeneous integration at fine pitch (≤ 10 µm) using thermal compression bonding AA Bajwa, SC Jangam, S Pal, N Marathe, T Bai, T Fukushima, M Goorsky, ... 2017 IEEE 67th electronic components and technology conference (ECTC), 1276-1284, 2017 | 108 | 2017 |
| Assembly and packaging technologies for high-temperature and high-power GaN devices AA Bajwa, Y Qin, R Reiner, R Quay, J Wilde IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 80 | 2015 |
| Latency, bandwidth and power benefits of the superchips integration scheme SC Jangam, S Pal, A Bajwa, S Pamarti, P Gupta, SS Iyer 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 86-94, 2017 | 57 | 2017 |
| Flexible hybrid electronics technology using die-first FOWLP for high-performance and scalable heterogeneous system integration T Fukushima, A Alam, A Hanna, SC Jangam, AA Bajwa, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 51 | 2018 |
| Reliability modeling of Sn–Ag transient liquid phase die-bonds for high-power SiC devices AA Bajwa, J Wilde Microelectronics Reliability 60, 116-125, 2016 | 47 | 2016 |
| Electrical characterization of high performance fine pitch interconnects in silicon-interconnect fabric SC Jangam, AA Bajwa, KK Thankkappan, P Kittur, SS Iyer 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1283-1288, 2018 | 46 | 2018 |
| Fine-pitch (≤ 10 µm) direct Cu-Cu interconnects using in-situ formic acid vapor treatment SC Jangam, AA Bajwa, U Mogera, P Ambhore, T Colosimo, B Chylak, ... 2019 IEEE 69th electronic components and technology conference (ECTC), 620-627, 2019 | 43 | 2019 |
| A case for packageless processors S Pal, D Petrisko, AA Bajwa, P Gupta, SS Iyer, R Kumar 2018 IEEE international symposium on high performance computer architecture …, 2018 | 38 | 2018 |
| “FlexTrate^ TM”—Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP T Fukushima, A Alam, Z Wan, SC Jangam, S Pal, G Ezhilarasu, A Bajwa, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 649-654, 2017 | 32 | 2017 |
| Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (< 6 µm) and Reliable Flexible Cu-Based … A Hanna, A Alam, T Fukushima, S Moran, W Whitehead, SC Jangam, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1505-1511, 2018 | 27 | 2018 |
| Demonstration of a heterogeneously integrated system-on-wafer (SoW) assembly AA Bajwa, SC Jangam, S Pal, B Vaisband, R Irwin, M Goorsky, SS Iyer 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1926-1930, 2018 | 23 | 2018 |
| Comparison of new die-attachment technologies for power electronic assemblies E Möller, AA Bajwa, E Rastjagaev, J Wilde 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1707-1713, 2014 | 23 | 2014 |
| Effect of Plasma Treatments and Plasma‐P olymerized Films on the Adhesion of Parylene‐C to Substrates D Zeniieh, A Bajwa, L Ledernez, G Urban Plasma Processes and Polymers 10 (12), 1081-1089, 2013 | 23 | 2013 |
| Process optimization and characterization of a novel micro-scaled silver sintering paste as a die-attach material for high temperature high power semiconductor devices AA Bajwa, R Zeiser, J Wilde Proceedings of the 36th International Spring Seminar on Electronics …, 2013 | 22 | 2013 |
| New assembly and packaging technologies for high-power and high-temperature GaN and SiC devices AA Bajwa Dissertation, Albert-Ludwigs-Universität Freiburg, 2015, 2015 | 21 | 2015 |
| Die-attachment technologies for high-temperature applications of Si and SiC-based power devices AA Bajwa, E Möller, J Wilde 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2168-2174, 2015 | 17 | 2015 |
| Assembly and packaging technologies for high-temperature and high-power GaN HEMTs AA Bajwa, Y Qin, J Wilde, R Reiner, P Waltereit, R Quay 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2181-2188, 2014 | 17 | 2014 |
| Foil based transient liquid phase bonding as a die-attachment method for high temperature devices AA Bajwa, YY Qin, R Zeiser CIPS 2014; 8th International Conference on Integrated Power Electronics …, 2014 | 16 | 2014 |
| Reliability challenges in advance packaging SS Iyer, AA Bajwa 2018 IEEE International Reliability Physics Symposium (IRPS), 4D. 5-1-4D. 5-4, 2018 | 12 | 2018 |
| Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding MS Goorsky, K Schjųlberg-Henriksen, B Beekley, T Bai, K Mani, ... Japanese Journal of Applied Physics 57 (2S1), 02BC03, 2017 | 12 | 2017 |
SUBRAMANIAN S. IYERUniversity of California at Los Angeles,Verified email at g.ucla.edu
