Daniel Wheeler
Title
Cited by
Cited by
Year
Superconformal film growth: Mechanism and quantification
TP Moffat, D Wheeler, MD Edelstein, D Josell
IBM Journal of Research and Development 49 (1), 19-36, 2005
4072005
Superconformal electrodeposition of copper
TP Moffat, D Wheeler, WH Huber, D Josell
Electrochemical and Solid State Letters 4 (4), C26, 2001
3892001
Electrodeposition of copper in the SPS-PEG-Cl additive system: I. kinetic measurements: Influence of SPS
TP Moffat, D Wheeler, D Josell
Journal of The Electrochemical Society 151 (4), C262, 2004
3402004
FiPy: Partial differential equations with Python
JE Guyer, D Wheeler, JA Warren
Computing in Science & Engineering 11 (3), 6-15, 2009
2872009
Superconformal electrodeposition in submicron features
D Josell, D Wheeler, WH Huber, TP Moffat
Physical Review Letters 87 (1), 016102, 2001
2142001
Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers
D Josell, D Wheeler, C Witt, TP Moffat
Electrochemical and Solid State Letters 6 (10), C143, 2003
1742003
A simple equation for predicting superconformal electrodeposition in submicrometer trenches
D Josell, D Wheeler, WH Huber, JE Bonevich, TP Moffat
Journal of the Electrochemical Society 148 (12), C767, 2001
1712001
Modeling superconformal electrodeposition using the level set method
D Wheeler, D Josell, TP Moffat
Journal of The Electrochemical Society 150 (5), C302, 2003
1432003
Curvature enhanced adsorbate coverage model for electrodeposition
TP Moffat, D Wheeler, SK Kim, D Josell
Journal of the Electrochemical Society 153 (2), C127, 2006
1402006
Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
TP Moffat, D Wheeler, SK Kim, D Josell
Electrochimica Acta 53 (1), 145-154, 2007
1282007
Accelerator surface phase associated with superconformal Cu electrodeposition
TP Moffat, LYO Yang
Journal of The Electrochemical Society 157 (4), D228, 2010
872010
Modeling extreme bottom-up filling of through silicon vias
D Josell, D Wheeler, TP Moffat
Journal of the Electrochemical Society 159 (10), D570, 2012
842012
Accelerator aging effects during copper electrodeposition
TP Moffat, B Baker, D Wheeler, D Josell
Electrochemical and Solid State Letters 6 (4), C59, 2003
772003
Via filling by electrodeposition: Superconformal silver and copper and conformal nickel
D Josell, B Baker, C Witt, D Wheeler, TP Moffat
Journal of the Electrochemical Society 149 (12), C637, 2002
772002
Superconformal electrodeposition using derivitized substrates
TP Moffat, D Wheeler, C Witt, D Josell
Electrochemical and Solid State Letters 5 (12), C110, 2002
712002
Superconformal electrodeposition of silver from a KAg (CN) 2 KCN KSeCN electrolyte
BC Baker, M Freeman, B Melnick, D Wheeler, D Josell, TP Moffat
Journal of the Electrochemical Society 150 (2), C61, 2002
682002
Superconformal electrodeposition of silver in submicrometer features
TP Moffat, B Baker, D Wheeler, JE Bonevich, M Edelstein, DR Kelly, ...
Journal of the Electrochemical Society 149 (8), C423, 2002
682002
Formation mechanisms of self-organized core/shell and core/shell/corona microstructures in liquid droplets of immiscible alloys
RP Shi, CP Wang, D Wheeler, XJ Liu, Y Wang
Acta materialia 61 (4), 1229-1243, 2013
652013
Superfilling when adsorbed accelerators are mobile
D Josell, TP Moffat, D Wheeler
Journal of the Electrochemical Society 154 (4), D208, 2007
572007
Superconformal electrodeposition in vias
D Josell, D Wheeler, TP Moffat
Electrochemical and Solid State Letters 5 (4), C49, 2002
562002
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Articles 1–20