Jeff Punch
Jeff Punch
Stokes Labs, Bernal Institute, University of Limerick
Verified email at ul.ie - Homepage
TitleCited byYear
From chip to cooling tower data center modeling: Influence of server inlet temperature and temperature rise across cabinet
TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash
Journal of Electronic Packaging 133 (1), 011004, 2011
1272011
Friction factor and heat transfer in multiple microchannels with uniform flow distribution
HS Park, J Punch
International Journal of Heat and Mass Transfer 51 (17-18), 4535-4543, 2008
912008
Pressure drop in two phase slug/bubble flows in mini scale capillaries
E Walsh, Y Muzychka, P Walsh, V Egan, J Punch
International Journal of Multiphase Flow 35 (10), 879-884, 2009
732009
Modeling electronic cooling axial fan flows
R Grimes, M Davies, J Punch, T Dalton, R Cole
J. Electron. Packag. 123 (2), 112-119, 2000
662000
Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys
M Reid, J Punch, M Collins, C Ryan
Soldering & Surface Mount Technology 20 (4), 3-8, 2008
622008
Energy scavenging for energy efficiency in networks and applications
K Joon Kim, F Cottone, S Goyal, J Punch
Bell Labs Technical Journal 15 (2), 7-29, 2010
582010
Design and fabrication of a hybrid superhydrophobic–hydrophilic surface that exhibits stable dropwise condensation
B Mondal, M Mac Giolla Eain, QF Xu, VM Egan, J Punch, AM Lyons
ACS applied materials & interfaces 7 (42), 23575-23588, 2015
552015
Energy harvester apparatus having improved efficiency
F Cottone, S Goyal, J Punch
US Patent 8,350,394, 2013
542013
A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions
D Herkommer, J Punch, M Reid
Microelectronics Reliability 50 (1), 116-126, 2010
492010
Film thickness measurements in liquid–liquid slug flow regimes
MMG Eain, V Egan, J Punch
International Journal of Heat and Fluid Flow 44, 515-523, 2013
462013
Finite element modelling of a BGA package subjected to thermal and power cycling
B Rodgers, J Punch, J Jarvis
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002
432002
The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor
R Coyle, M Reid, C Ryan, R Popowich, P Read, D Fleming, M Collins, ...
2009 59th Electronic Components and Technology Conference, 423-430, 2009
392009
From chip to cooling tower data center modeling: Part II influence of chip temperature control philosophy
EJ Walsh, TJ Breen, J Punch, AJ Shah, CE Bash
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010
372010
Enhanced vibrational energy harvester based on velocity amplification
F Cottone, R Frizzell, S Goyal, G Kelly, J Punch
Journal of Intelligent Material Systems and Structures 25 (4), 443-451, 2014
362014
Phenomenological study of the effect of microstructural evolution on the thermal fatigue resistance of Pb-free solder joints
R Coyle, J Osenbach, MN Collins, H McCormick, P Read, D Fleming, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
362011
Determination of the Anand viscoplasticity model constants for SnAgCu
B Rodgers, B Flood, J Punch, F Waldron
ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and …, 2005
312005
Experimental determination and finite element model validation of the Anand viscoplasticity model constants for SnAgCu
B Rodgers, BEN Flood, J Punch, F Waldron
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal …, 2006
302006
Thermal fatigue and failure analysis of SnAgCu solder alloys with minor Pb additions
MN Collins, J Punch, R Coyle, M Reid, R Popowich, P Read, D Fleming
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
262011
The corrosion of electronic resistors
M Reid, J Punch, C Ryan, J Franey, GE Derkits, WD Reents, LF Garfias
IEEE Transactions on Components and Packaging Technologies 30 (4), 666-672, 2007
262007
Study of mixed flowing gas exposure of copper
M Reid, J Punch, LF Garfias-Mesias, K Shannon, S Belochapkine, ...
Journal of the Electrochemical Society 155 (4), C147-C153, 2008
252008
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Articles 1–20