Moisture absorption and diffusion characterization of molding compound X Chen, S Zhao, L Zhai | 82 | 2005 |
Investigation of delamination control in plastic package S Zhao, X Pang Microelectronics Reliability 49 (3), 350-356, 2009 | 18 | 2009 |
Lead frame for semiconductor device Y Lu, B Tian, N Xu, J Yao, S Zhao US Patent 8,115,288, 2012 | 8 | 2012 |
Impact of hygroswelling and vapor pressure on delamination S Zhao, X Chen, J Yao 2006 8th Electronics Packaging Technology Conference, 773-780, 2006 | 7 | 2006 |
Moisture absorption of molding compound and organic substrate S Zhao 2011 International Symposium on Advanced Packaging Materials (APM), 387-393, 2011 | 5 | 2011 |
Qfn device and lead frame therefor N Xu, X Pang, B Tian, S Zhao US Patent App. 13/549,517, 2013 | 4 | 2013 |
Dual corner top gate molding BY Low, TB Lau, SK Teng, S Zhao US Patent App. 14/464,719, 2015 | 1 | 2015 |
Analyses of Stress and Deformation of the Orbiting Scroll of a Scroll Compressor S Zhao, X Chen, T Tian CHEMICAL ENGINEERING AND MACHINERY 30 (1), 17-20, 2003 | 1 | 2003 |
Semiconductor device package BJ Carpenter, BY Low, S Zhao US Patent 8,802,508, 2014 | | 2014 |
A mold flow model with method of cells to better understand IC packaging BY Low, S Teh, PF Tong, SF Zhao 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 255-258, 2013 | | 2013 |
Lead frame for semiconductor die Z Tian, Q He, Q Liu, J Yang, S Zhao US Patent App. 13/004,031, 2011 | | 2011 |
Interface Cracking of Plastic Electronic Package under Temperature and Humidity Environment X Chen, SF Zhao, L Zhai Key Engineering Materials 353, 2940-2943, 2007 | | 2007 |
PART 4-Section 17-Package Materials and Related Issues of IT-Interface Cracking of Plastic Electronic Package under Temperature and Humidity Environment X Chen, SF Zhao, L Zhai Key Engineering Materials 353358, 2940-2943, 2007 | | 2007 |