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Shufeng ZHAO
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Cited by
Year
Moisture absorption and diffusion characterization of molding compound
X Chen, S Zhao, L Zhai
822005
Investigation of delamination control in plastic package
S Zhao, X Pang
Microelectronics Reliability 49 (3), 350-356, 2009
172009
Lead frame for semiconductor device
Y Lu, B Tian, N Xu, J Yao, S Zhao
US Patent 8,115,288, 2012
82012
Impact of hygroswelling and vapor pressure on delamination
S Zhao, X Chen, J Yao
2006 8th Electronics Packaging Technology Conference, 773-780, 2006
72006
Moisture absorption of molding compound and organic substrate
S Zhao
2011 International Symposium on Advanced Packaging Materials (APM), 387-393, 2011
52011
Qfn device and lead frame therefor
N Xu, X Pang, B Tian, S Zhao
US Patent App. 13/549,517, 2013
42013
Dual corner top gate molding
BY Low, TB Lau, SK Teng, S Zhao
US Patent App. 14/464,719, 2015
12015
Analyses of Stress and Deformation of the Orbiting Scroll of a Scroll Compressor
S Zhao, X Chen, T Tian
CHEMICAL ENGINEERING AND MACHINERY 30 (1), 17-20, 2003
12003
Semiconductor device package
BJ Carpenter, BY Low, S Zhao
US Patent 8,802,508, 2014
2014
A mold flow model with method of cells to better understand IC packaging
BY Low, S Teh, PF Tong, SF Zhao
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 255-258, 2013
2013
Lead frame for semiconductor die
Z Tian, Q He, Q Liu, J Yang, S Zhao
US Patent App. 13/004,031, 2011
2011
Interface Cracking of Plastic Electronic Package under Temperature and Humidity Environment
X Chen, SF Zhao, L Zhai
Key Engineering Materials 353, 2940-2943, 2007
2007
PART 4-Section 17-Package Materials and Related Issues of IT-Interface Cracking of Plastic Electronic Package under Temperature and Humidity Environment
X Chen, SF Zhao, L Zhai
Key Engineering Materials 353358, 2940-2943, 2007
2007
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