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Gurdaman khaira
Gurdaman khaira
University of Chicago, Mentor Graphics Corporation, Graphcore Inc., Siemens EDA
Verified email at siemens.com
Title
Cited by
Cited by
Year
Molecular pathways for defect annihilation in directed self-assembly
SM Hur, V Thapar, A Ramírez-Hernández, G Khaira, T Segal-Peretz, ...
Proceedings of the National Academy of Sciences 112 (46), 14144-14149, 2015
1162015
Simulation of defect reduction in block copolymer thin films by solvent annealing
SM Hur, GS Khaira, A Ramírez-Hernández, M Müller, PF Nealey, ...
ACS Macro Letters 4 (1), 11-15, 2015
932015
Evolutionary optimization of directed self-assembly of triblock copolymers on chemically patterned substrates
GS Khaira, J Qin, GP Garner, S Xiong, L Wan, R Ruiz, HM Jaeger, ...
ACS Macro Letters 3 (8), 747-752, 2014
832014
Turning statistical physics models into materials design engines
MZ Miskin, G Khaira, JJ de Pablo, HM Jaeger
Proceedings of the National Academy of Sciences 113 (1), 34-39, 2016
802016
Evolutionary pattern design for copolymer directed self-assembly
J Qin, GS Khaira, Y Su, GP Garner, M Miskin, HM Jaeger, JJ de Pablo
Soft Matter 9 (48), 11467-11472, 2013
712013
Quantitative three-dimensional characterization of block copolymer directed self-assembly on combined chemical and topographical prepatterned templates
T Segal-Peretz, J Ren, S Xiong, G Khaira, A Bowen, LE Ocola, R Divan, ...
ACS nano 11 (2), 1307-1319, 2017
512017
Derivation of multiple covarying material and process parameters using physics-based modeling of X-ray data
G Khaira, M Doxastakis, A Bowen, J Ren, HS Suh, T Segal-Peretz, ...
Macromolecules 50 (19), 7783-7793, 2017
352017
Physical verification and manufacturing of contact/via layers using grapho-epitaxy DSA processes
JA Torres, K Sakajiri, D Fryer, Y Granik, Y Ma, P Krasnova, G Fenger, ...
Design-Process-Technology Co-optimization for Manufacturability VIII 9053 …, 2014
202014
Optimizing self-consistent field theory block copolymer models with X-ray metrology
AF Hannon, DF Sunday, A Bowen, G Khaira, J Ren, PF Nealey, ...
Molecular systems design & engineering 3 (2), 376-389, 2018
152018
Directed self assembly (DSA) compliant flow with immersion lithography: from material to design and patterning
Y Ma, Y Wang, J Word, J Lei, J Mitra, JA Torres, L Hong, G Fenger, ...
Alternative Lithographic Technologies VIII 9777, 117-127, 2016
122016
Probability prediction of EUV process failure due to resist-exposure stochastic: applications of Gaussian random fields excursions and Rice's formula
A Latypov, G Khaira, G Fenger, J Sturtevant, CI Wei, P De Bisschop
Extreme Ultraviolet (EUV) Lithography XI 11323, 140-164, 2020
112020
Gaussian random field EUV stochastic models, their generalizations and lithographically meaningful stochastic metrics
A Latypov, G Khaira, G Fenger, S Wang, M Chew, S Shang
Extreme Ultraviolet (EUV) Lithography XII 11609, 104-119, 2021
102021
Scalable simulations for directed self-assembly patterning with the use of GPU parallel computing
K Yoshimoto, BL Peters, GS Khaira, JJ de Pablo
Alternative Lithographic Technologies IV 8323, 568-578, 2012
92012
A comprehensive evaluation of novel AI accelerators for deep learning workloads
M Emani, Z Xie, S Raskar, V Sastry, W Arnold, B Wilson, R Thakur, ...
2022 IEEE/ACM international workshop on performance modeling, benchmarking …, 2022
82022
Calibration and application of Gaussian random field models for exposure and resist stochastic in EUV lithography
CI Wei, A Latypov, P De Bisschop, G Khaira, G Fenger
Japanese Journal of Applied Physics 61 (SD), SD0806, 2022
52022
Better prediction on patterning failure mode with hotspot aware OPC modeling
CI Wei, S Wu, Y Deng, G Khaira, I Kusnadi, G Fenger, S Kang, Y Okamoto, ...
Metrology, Inspection, and Process Control for Semiconductor Manufacturing …, 2021
52021
Directed self-assembly compliant flow with immersion lithography: from material to design and patterning
Y Ma, Y Wang, J Word, J Lei, J Mitra, JA Torres, L Hong, G Fenger, ...
Journal of Micro/Nanolithography, MEMS, and MOEMS 15 (3), 031610-031610, 2016
52016
Method and system for calculating probability of success or failure for a lithographic process due to stochastic variations of the lithographic process
G Khaira, GL Fenger, A Latypov, JL Sturtevant, Y Granik
US Patent 11,061,373, 2021
42021
Design technology co-optimization (DTCO) study on self-aligned-Via (SAV) with lamella DSA for sub-7 nm technology
Y Ma, J Kye, GS Khaira, L Hong, J Word, Y Sun, J Mitra, JA Torres, ...
Design-Process-Technology Co-optimization for Manufacturability XI 10148, 74-85, 2017
42017
Optimizing directed self-assembled morphology
J Qin, GS Khaira, Y Su, GP Garner, M Miskin, HM Jaeger, JJ de Pablo
arXiv preprint arXiv:1308.0622, 2013
22013
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