Samjid H. Mannan
Title
Cited by
Cited by
Year
A review: On the development of low melting temperature Pb-free solders
HR Kotadia, PD Howes, SH Mannan
Microelectronics Reliability 54 (6-7), 1253-1273, 2014
2652014
Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
JF Li, SH Mannan, MP Clode, DC Whalley, DA Hutt
Acta Materialia 54 (11), 2907-2922, 2006
1712006
Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates
HR Kotadia, O Mokhtari, MP Clode, MA Green, SH Mannan
Journal of Alloys and Compounds 511 (1), 176-188, 2012
1082012
Review of silver nanoparticle based die attach materials for high power/temperature applications
SA Paknejad, SH Mannan
Microelectronics Reliability 70, 1-11, 2017
872017
Microstructure evolution during 300 C storage of sintered Ag nanoparticles on Ag and Au substrates
SA Paknejad, G Dumas, G West, G Lewis, SH Mannan
Journal of Alloys and Compounds 617, 994-1001, 2014
672014
Conduction mechanisms in anisotropic conducting adhesive assembly
CN Oguibe, SH Mannan, DC Whalley, DJ Williams
Proceedings. The First IEEE International Symposium on Polymeric Electronics …, 1997
671997
The top quark condensate
SF King, SH Mannan
Physics Letters B 241 (2), 249-254, 1990
651990
Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation
DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan
IEEE transactions on components and packaging technologies 25 (1), 87-97, 2002
642002
Materials and processes for implementing high-temperature liquid interconnects
SH Mannan, MP Clode
IEEE transactions on advanced packaging 27 (3), 508-514, 2004
632004
Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders
JF Li, SH Mannan, MP Clode, K Chen, DC Whalley, C Liu, DA Hutt
Acta materialia 55 (2), 737-752, 2007
582007
Reactions of Sn-3.5 Ag-based solders containing Zn and Al additions on Cu and Ni (P) substrates
HR Kotadia, O Mokhtari, M Bottrill, MP Clode, MA Green, SH Mannan
Journal of electronic materials 39 (12), 2720-2731, 2010
542010
Squeegee deformation study in the stencil printing of solder pastes
SH Mannan, NN Ekere, I Ismail, EK Lo
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1994
481994
Semi-active suspension system simulation using Simulink
S Abramov, S Mannan, O Durieux
International Journal of Engineering Systems Modelling and Simulation 1 (2-3 …, 2009
382009
Synthesis and characterization of gold nanoshells using poly (diallyldimethyl ammonium chloride)
R Ashayer, SH Mannan, S Sajjadi
Colloids and Surfaces A: Physicochemical and Engineering Aspects 329 (3 …, 2008
382008
A comparative study of the interfacial reaction between electroless Ni–P coatings and molten tin
K Chen, C Liu, DC Whalley, DA Hutt, JF Li, SH Mannan
Acta Materialia 56 (19), 5668-5676, 2008
272008
Anisotropic conducting adhesives for electronic assembly
DC Whalley, SH Mannan, DJ Williams
Assembly Automation, 1997
271997
Flow processes in solder paste during stencil printing for SMT assembly
SH Mannan, NN Ekere, I Ismail, MA Currie
Journal of Materials Science: Materials in Electronics 6 (1), 34-42, 1995
271995
Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating
DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan
IEEE transactions on components and packaging technologies 25 (1), 98-105, 2002
262002
Thermally stable high temperature die attach solution
SA Paknejad, A Mansourian, Y Noh, K Khtatba, SH Mannan
Materials & Design 89, 1310-1314, 2016
252016
Predicting scooping and skipping in solder paste printing for reflow soldering of SMT devices
SH Mannan, NN Ekere, EK Lo, I Ismail
Soldering & Surface Mount Technology, 1993
251993
The system can't perform the operation now. Try again later.
Articles 1–20