| A highly sensitive and flexible pressure sensor with electrodes and elastomeric interlayer containing silver nanowires J Wang, J Jiu, M Nogi, T Sugahara, S Nagao, H Koga, P He, K Suganuma Nanoscale 7 (7), 2926-2932, 2015 | 306 | 2015 |
| Facile synthesis of very-long silver nanowires for transparent electrodes J Jiu, T Araki, J Wang, M Nogi, T Sugahara, S Nagao, H Koga, ... Journal of Materials Chemistry A 2 (18), 6326-6330, 2014 | 274 | 2014 |
| Low haze transparent electrodes and highly conducting air dried films with ultra-long silver nanowires synthesized by one-step polyol method T Araki, J Jiu, M Nogi, H Koga, S Nagao, T Sugahara, K Suganuma Nano Research 7, 236-245, 2014 | 201 | 2014 |
| One-step fabrication of stretchable copper nanowire conductors by a fast photonic sintering technique and its application in wearable devices S Ding, J Jiu, Y Gao, Y Tian, T Araki, T Sugahara, S Nagao, M Nogi, ... ACS applied materials & interfaces 8 (9), 6190-6199, 2016 | 169 | 2016 |
| Silver nanowire electrodes: conductivity improvement without post-treatment and application in capacitive pressure sensors J Wang, J Jiu, T Araki, M Nogi, T Sugahara, S Nagao, H Koga, P He, ... Nano-Micro Letters 7, 51-58, 2015 | 146 | 2015 |
| The role of Zn precipitates and Cl− anions in pitting corrosion of Sn–Zn solder alloys JC Liu, SW Park, S Nagao, M Nogi, H Koga, JS Ma, G Zhang, ... Corrosion Science 92, 263-271, 2015 | 144 | 2015 |
| Precision of nanoindentation protocols for measurement of viscoelasticity in cortical and trabecular bone H Isaksson, S Nagao, M MaŁkiewicz, P Julkunen, R Nowak, JS Jurvelin Journal of biomechanics 43 (12), 2410-2417, 2010 | 124 | 2010 |
| Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air Z Zhang, C Chen, Y Yang, H Zhang, D Kim, T Sugahara, S Nagao, ... Journal of Alloys and Compounds 780, 435-442, 2019 | 120 | 2019 |
| The effect of light and humidity on the stability of silver nanowire transparent electrodes J Jiu, J Wang, T Sugahara, S Nagao, M Nogi, H Koga, K Suganuma, ... Rsc Advances 5 (35), 27657-27664, 2015 | 114 | 2015 |
| Cu salt ink formulation for printed electronics using photonic sintering T Araki, T Sugahara, J Jiu, S Nagao, M Nogi, H Koga, H Uchida, ... Langmuir 29 (35), 11192-11197, 2013 | 101 | 2013 |
| Die bonding performance using bimodal Cu particle paste under different sintering atmospheres Y Gao, H Zhang, W Li, J Jiu, S Nagao, T Sugahara, K Suganuma Journal of Electronic Materials 46, 4575-4581, 2017 | 94 | 2017 |
| Role of five-fold twin boundary on the enhanced mechanical properties of fcc Fe nanowires JY Wu, S Nagao, JY He, ZL Zhang Nano letters 11 (12), 5264-5273, 2011 | 93 | 2011 |
| Mechanical deformation of sintered porous Ag die attach at high temperature and its size effect for wide-bandgap power device design C Chen, S Nagao, H Zhang, J Jiu, T Sugahara, K Suganuma, T Iwashige, ... Journal of Electronic Materials 46, 1576-1586, 2017 | 90 | 2017 |
| Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere Y Gao, W Li, C Chen, H Zhang, J Jiu, CF Li, S Nagao, K Suganuma Materials & Design 160, 1265-1272, 2018 | 89 | 2018 |
| Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices C Chen, S Nagao, K Suganuma, J Jiu, T Sugahara, H Zhang, T Iwashige, ... Acta Materialia 129, 41-51, 2017 | 86 | 2017 |
| Nano-volcanic eruption of silver S Lin, S Nagao, E Yokoi, C Oh, H Zhang, Y Liu, S Lin, K Suganuma Scientific reports 6 (1), 34769, 2016 | 86 | 2016 |
| Nanoindentation examination of yttria-stabilized zirconia (YSZ) crystal M Fujikane, D Setoyama, S Nagao, R Nowak, S Yamanaka Journal of Alloys and Compounds 431 (1-2), 250-255, 2007 | 85 | 2007 |
| An electric current spike linked to nanoscale plasticity R Nowak, D Chrobak, S Nagao, D Vodnick, M Berg, A Tukiainen, M Pessa Nature Nanotechnology 4 (5), 287-291, 2009 | 81 | 2009 |
| Die-attaching silver paste based on a novel solvent for high-power semiconductor devices J Jiu, H Zhang, S Nagao, T Sugahara, N Kagami, Y Suzuki, Y Akai, ... Journal of materials science 51, 3422-3430, 2016 | 79 | 2016 |
| Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices S Sakamoto, S Nagao, K Suganuma Journal of Materials Science: Materials in Electronics 24, 2593-2601, 2013 | 79 | 2013 |
Chuantong ChenOsaka UniversityVerified email at sanken.osaka-u.ac.jp
