Katayun Barmak
Katayun Barmak
Professor of Applied Physics and Applied Mathematics, Columbia University
Verified email at columbia.edu
Cited by
Cited by
On the relationship of high coercivity and ordered phase in CoPt and FePt thin films
RA Ristau, K Barmak, LH Lewis, KR Coffey, JK Howard
Journal of applied physics 86 (8), 4527-4533, 1999
On the relationship of magnetocrystalline anisotropy and stoichiometry in epitaxial CoPt (001) and FePt (001) thin films
K Barmak, J Kim, LH Lewis, KR Coffey, MF Toney, AJ Kellock, JU Thiele
Journal of Applied Physics 98 (3), 033904, 2005
Investigating the thermodynamics and kinetics of thin film reactions by differential scanning calorimetry
C Michaelsen, K Barmak, TP Weihs
Journal of Physics D: Applied Physics 30 (23), 3167, 1997
The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films
LA Clevenger, A Mutscheller, JME Harper, C Cabral Jr, K Barmak
Journal of Applied Physics 72 (10), 4918-4924, 1992
Simulation of Hubbard model physics in WSe 2/WS 2 moiré superlattices
Y Tang, L Li, T Li, Y Xu, S Liu, K Barmak, K Watanabe, T Taniguchi, ...
Nature 579 (7799), 353-358, 2020
Surface and grain-boundary scattering in nanometric Cu films
T Sun, B Yao, AP Warren, K Barmak, MF Toney, RE Peale, KR Coffey
Physical Review B 81 (15), 155454, 2010
Experimental evidence for nucleation during thin‐film reactions
KR Coffey, LA Clevenger, K Barmak, DA Rudman, CV Thompson
Applied physics letters 55 (9), 852-854, 1989
Reactive phase formation in sputter-deposited Ni/Al multilayer thin films
K Barmak, C Michaelsen, G Lucadamo
Journal of materials research 12 (1), 133-146, 1997
The early stages of solid‐state reactions in Ni/Al multilayer films
C Michaelsen, G Lucadamo, K Barmak
Journal of applied physics 80 (12), 6689-6698, 1996
On the use of alloying elements for Cu interconnect applications
K Barmak, C Cabral Jr, KP Rodbell, JME Harper
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2006
Igniting innovation: rethinking the role of government in emerging Europe and Central Asia
I Goldberg, JG Goddard, S Kuriakose, JL Racine
World Bank Publications, 2011
Dominant role of grain boundary scattering in the resistivity of nanometric Cu films
T Sun, B Yao, AP Warren, K Barmak, MF Toney, RE Peale, KR Coffey
Physical Review B 79 (4), 041402, 2009
Calorimetric studies of the to transformation in FePt and CoPt thin films
K Barmak, J Kim, S Shell, EB Svedberg, JK Howard
Applied physics letters 80 (22), 4268-4270, 2002
Electrodeposited NiAl particle composite coatings
DF Susan, K Barmak, AR Marder
Thin Solid Films 307 (1-2), 133-140, 1997
Deterministic coupling of site-controlled quantum emitters in monolayer WSe 2 to plasmonic nanocavities
Y Luo, GD Shepard, JV Ardelean, DA Rhodes, B Kim, K Barmak, JC Hone, ...
Nature nanotechnology 13 (12), 1137-1142, 2018
Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity
K Barmak, A Gungor, C Cabral Jr, JME Harper
Journal of applied physics 94 (3), 1605-1616, 2003
Method and process to make multiple-threshold metal gates CMOS technology
R Amos, K Barmak, DC Boyd, C Cabral Jr, M Leong, TS Kanarsky, ...
US Patent 6,846,734, 2005
Formation of boride layers at the Fe–10% Cr alloy–boron interface
VI Dybkov, W Lengauer, K Barmak
Journal of Alloys and Compounds 398 (1-2), 113-122, 2005
Advancements in the treatment and processing of electronic waste with sustainability: a review of metal extraction and recovery technologies
E Hsu, K Barmak, AC West, AHA Park
Green chemistry 21 (5), 919-936, 2019
Grain growth and the puzzle of its stagnation in thin films: The curious tale of a tail and an ear
K Barmak, E Eggeling, D Kinderlehrer, R Sharp, S Ta’asan, AD Rollett, ...
Progress in Materials Science 58 (7), 987-1055, 2013
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