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Co-authors
Shuilin WUHubei UniversityVerified email at hubu.edu.cn
Kelvin YeungDepartment of Orthopaedics and Traumatology, The University of Hong KongVerified email at hku.hk
Xuenan GuBeihang UniversityVerified email at buaa.edu.cn
Huafang Li, Ph.D, Associate ProfessorCurrent: University of Science and Technology Beijing; Previous: The Chinese University of Hong KongVerified email at pku.edu.cn
Yanbo WangCurrent: Angstron Materals Inc., Previously: Peking UniversityVerified email at angstronmaterials.com
C.S. LeeCity University of Hong KongVerified email at cityu.edu.hk
Ning WangHong Kong University of Science and TechnologyVerified email at ust.hk
Paul K ChuChair Professor of Materials Engineering, City University of Hong KongVerified email at cityu.edu.hk
Yinong LiuThe University of Western AustraliaVerified email at uwa.edu.au
Liyuan ShengShenzhen Institute, Peking UniversityVerified email at imr.ac.cn
Hoi Man WongThe University of Hong KongVerified email at hku.hk
Professor Hong YangThe University of Western AustraliaVerified email at uwa.edu.au
Junqiang Wang (王军强)Chinese Academy of Science, Ningbo Institute of Materials Technology and EngineeringVerified email at nimte.ac.cn
Jonathan C.Y. ChungDept. of Physics & Materials Science, City University of Hong KongVerified email at cityu.edu.hk
Yanbo WangPeking UniversityVerified email at angstronmaterials.com
Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionVerified email at tx.technion.ac.il
Ruiqin ZHANGCity University of Hong KongVerified email at cityu.edu.hk
Zhong Lin WangGeorgia Institute of Technology; Beijing Institute of Nanoenergy and NanosystemsVerified email at mse.gatech.edu
Ming LiPhD in BiomaterialsVerified email at pku.edu.cn