| The prediction of failure pressure of gas pipeline with multi corroded region YK Lee, YP Kim, MW Moon, WH Bang, KH Oh, WS Kim Materials Science Forum 475, 3323-3326, 2005 | 34 | 2005 |
| Characterization of solder joint reliability using cyclic mechanical fatigue testing CU Kim, WH Bang, H Xu, TK Lee JOM 65, 1362-1373, 2013 | 28 | 2013 |
| Study of fracture mechanics in testing interfacial fracture of solder joints WH Bang, MW Moon, CU Kim, SH Kang, JP Jung, KH Oh Journal of Electronic Materials 37, 417-428, 2008 | 24 | 2008 |
| Microtexture analysis of friction stir welded Al 6061-T651 plates SH Kang, WH Bang, JH Cho, HN Han, KH Oh, CG Lee, SJ Kim Materials Science Forum 495, 901-906, 2005 | 24 | 2005 |
| Fracture mechanics of solder bumps during ball shear testing: effect of bump size WH Bang, CU Kim, SH Kang, KH Oh Journal of electronic materials 38, 1896-1905, 2009 | 22 | 2009 |
| Observation of space charge limited current by Cu ion drift in porous low-k/Cu interconnects LS Chen, WH Bang, YJ Park, ET Ryan, S King, CU Kim Applied Physics Letters 96 (9), 2010 | 15 | 2010 |
| Texture evolution in weld regions of SUS-304 stainless steel and TRIP steel XH Ha, SW Jang, WH Bang, US Yoon, KH Oh Materials Science Forum(Switzerland) 408 (2), 1377-1382, 2002 | 14 | 2002 |
| The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb WH Bang, KH Oh, JP Jung, JW Morris, F Hua Journal of electronic materials 34, 1287-1300, 2005 | 13 | 2005 |
| Microstructure and strength of Sn-Bi coated Sn-3.5 mass% Ag solder alloy J Lee, W Bang, J Jung, K Oh Materials Transactions 45 (3), 783-789, 2004 | 9 | 2004 |
| Rate dependence of bending fatigue failure characteristics of lead-free solder joint WH Bang, LS Chen, CU Kim, TK Lee, KC Liu 2009 59th Electronic Components and Technology Conference, 2070-2074, 2009 | 8 | 2009 |
| Application of TLP (Transient Liquid Phase) Bonding Method to the High Tm Lead-Free Solder JS Lee, WH Bang, JP Jung, KH Oh Materials Science Forum 475, 1869-1872, 2005 | 8 | 2005 |
| Study of viscoplastic deformation in porous organosilicate thin films for ultra low-k applications EH Zin, WH Bang, E Todd Ryan, SW King, CU Kim Applied Physics Letters 102 (22), 2013 | 7 | 2013 |
| Fracture mechanics of lead-free solder joints under cyclic shear load H Xu, WH Bang, HT Ma, TK Lee, KC Liu, CU Kim 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 6 | 2010 |
| High tensile strength of drawn gold SH Kang, HS Jung, WH Bang, JH Cho, KH Oh, DS Kim, JS Cho, YJ Park, ... Materials Science Forum 495, 907-912, 2005 | 6 | 2005 |
| Analysis of alligatoring behavior during roll pressing of DRI powder with flat roller and indentation-type roller SH Joo, HJ Chang, WH Bang, HN Han, KH Oh Materials Science Forum 475, 3223-3226, 2005 | 5 | 2005 |
| Isothermal shear fatigue mechanism of lead free solder joints H Xu, WH Bang, HT Ma, TK Lee, KC Liu, CU Kim 2012 IEEE 62nd Electronic Components and Technology Conference, 1299-1303, 2012 | 4 | 2012 |
| Fabrication and Solderability Evaluation of SnBi Coated Sn 3. 5 wt pct Ag Alloy JS Lee, WH Bang, JP Jung, KH Oh Journal of the Korean Institute of Metals and Materials, 2004 | 3 | 2004 |
| Sensitivity of grain structure and fatigue reliability of Pb-free solder joint on the position in PBGA packaging assembly H Xu, WH Bang, TK Lee, CU Kim 2012 IEEE 62nd Electronic Components and Technology Conference, 500-504, 2012 | 2 | 2012 |
| Mechanism of Microstructure Evolution and Fatigue Failure in Lead Free Solder Joint JM Kim, WH Bang, CU Kim, TK Lee, H Ma, KC Liu Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2010 | 1 | 2010 |
| Bending Fatigue Characteristic of Sn-3.5 Ag Solder Bump on Ni-UBM KI Kang, JP Jung, WH Bang, JH Park, KH Oh Materials Science Forum 580, 177-182, 2008 | 1 | 2008 |
