| Reduced graphene oxide conformally wrapped silver nanowire networks for flexible transparent heating and electromagnetic interference shielding Y Yang, S Chen, W Li, P Li, J Ma, B Li, X Zhao, Z Ju, H Chang, L Xiao, ... Acs Nano 14 (7), 8754-8765, 2020 | 146 | 2020 |
| The rise of conductive copper inks: challenges and perspectives W Li, Q Sun, L Li, J Jiu, XY Liu, M Kanehara, T Minari, K Suganuma Applied Materials Today 18, 100451, 2020 | 104 | 2020 |
| Die bonding performance using bimodal Cu particle paste under different sintering atmospheres Y Gao, H Zhang, W Li, J Jiu, S Nagao, T Sugahara, K Suganuma Journal of Electronic Materials 46, 4575-4581, 2017 | 94 | 2017 |
| Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere Y Gao, W Li, C Chen, H Zhang, J Jiu, CF Li, S Nagao, K Suganuma Materials & Design 160, 1265-1272, 2018 | 88 | 2018 |
| Printable and flexible copper–silver alloy electrodes with high conductivity and ultrahigh oxidation resistance W Li, D Hu, L Li, CF Li, J Jiu, C Chen, T Ishina, T Sugahara, K Suganuma ACS applied materials & interfaces 9 (29), 24711-24721, 2017 | 82 | 2017 |
| Enhancing low-temperature and pressureless sintering of micron silver paste based on an ether-type solvent H Zhang, W Li, Y Gao, H Zhang, J Jiu, K Suganuma Journal of Electronic Materials 46, 5201-5208, 2017 | 68 | 2017 |
| Self-reducible copper inks composed of copper–amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate W Li, S Cong, J Jiu, S Nagao, K Suganuma Journal of Materials Chemistry C 4 (37), 8802-8809, 2016 | 63 | 2016 |
| Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement W Li, H Zhang, Y Gao, J Jiu, CF Li, C Chen, D Hu, Y Goya, Y Wang, ... Journal of Materials Chemistry C 5 (5), 1155-1164, 2017 | 60 | 2017 |
| Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term … W Li, L Li, Y Gao, D Hu, CF Li, H Zhang, J Jiu, S Nagao, K Suganuma Journal of Alloys and Compounds 732, 240-247, 2018 | 58 | 2018 |
| Large-scale and galvanic replacement free synthesis of Cu@ Ag core–shell nanowires for flexible electronics B Zhang, W Li, J Jiu, Y Yang, J Jing, K Suganuma, CF Li Inorganic Chemistry 58 (5), 3374-3381, 2019 | 51 | 2019 |
| Alloying and embedding of Cu-core/Ag-shell nanowires for ultrastable stretchable and transparent electrodes B Zhang, W Li, M Nogi, C Chen, Y Yang, T Sugahara, H Koga, ... ACS applied materials & interfaces 11 (20), 18540-18547, 2019 | 44 | 2019 |
| Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics B Zhang, W Li, Y Yang, C Chen, CF Li, K Suganuma Journal of materials science 54 (8), 6381-6392, 2019 | 38 | 2019 |
| Highly conductive Ag paste for recoverable wiring and reliable bonding used in stretchable electronics CF Li, W Li, H Zhang, J Jiu, Y Yang, L Li, Y Gao, ZQ Liu, K Suganuma ACS applied materials & interfaces 11 (3), 3231-3240, 2018 | 29 | 2018 |
| Efficient assembly of high-performance reduced graphene oxide/silver nanowire transparent conductive film based on in situ light-induced reduction technology L Li, W Li, J Jiu, K Suganuma Applied Surface Science 459, 732-740, 2018 | 26 | 2018 |
| A tube-shaped solid–liquid-interfaced triboelectric–electromagnetic hybrid nanogenerator for efficient ocean wave energy harvesting X Sun, C Shang, H Ma, C Li, L Xue, Q Xu, Z Wei, W Li, Y Yalikun, YC Lai, ... Nano Energy 100, 107540, 2022 | 22 | 2022 |
| Self-catalyzed copper–silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper–silver hybrid tracks at a low temperature below 100° C W Li, CF Li, F Lang, J Jiu, M Ueshima, H Wang, ZQ Liu, K Suganuma Nanoscale 10 (11), 5254-5263, 2018 | 20 | 2018 |
| Electric-current-assisted sintering of nanosilver paste for copper bonding Y Mei, L Li, X Li, W Li, H Yan, Y Xie Journal of Materials Science: Materials in Electronics 28, 9155-9166, 2017 | 20 | 2017 |
| Highly Densified Cu Wirings Fabricated from Air‐Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility W Li, Y Yang, B Zhang, CF Li, J Jiu, K Suganuma Advanced Materials Interfaces 5 (19), 1800798, 2018 | 18 | 2018 |
| Direct fabrication of high-resolution and high-performance flexible electronics via surface-activation-localized electroless plating W Li, L Li, Q Sun, X Liu, M Kanehara, T Nakayama, J Jiu, K Sakamoto, ... Chemical Engineering Journal 416, 127644, 2021 | 17 | 2021 |
| Well‐Controlled Decomposition of Copper Complex Inks Enabled by Metal Nanowire Networks for Highly Compact, Conductive, and Flexible Copper Films B Zhang, C Chen, W Li, J Yeom, K Suganuma Advanced Materials Interfaces 7 (1), 1901550, 2020 | 14 | 2020 |
Takeo MinariNational Institute for Materials Science (NIMS)Verified email at nims.go.jp
