Jae Jeong Kim
Jae Jeong Kim
Verified email at snu.ac.kr
Cited by
Cited by
Curvature enhanced adsorbate coverage model for electrodeposition
TP Moffat, D Wheeler, SK Kim, D Josell
Journal of the Electrochemical Society 153 (2), C127, 2006
Fabrication and characterization of a PDMS–glass hybrid continuous-flow PCR chip
JA Kim, JY Lee, S Seong, SH Cha, SH Lee, JJ Kim, TH Park
Biochemical Engineering Journal 29 (1-2), 91-97, 2006
Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
TP Moffat, D Wheeler, SK Kim, D Josell
Electrochimica Acta 53 (1), 145-154, 2007
Electrodeposition of Cu in the PEI-PEG-Cl-SPS additive system: reduction of overfill bump formation during superfilling
SK Kim, D Josell, TP Moffat
Journal of The Electrochemical Society 153 (9), C616, 2006
Electrodeposited Ni dendrites with high activity and durability for hydrogen evolution reaction in alkaline water electrolysis
SH Ahn, SJ Hwang, SJ Yoo, I Choi, HJ Kim, JH Jang, SW Nam, TH Lim, ...
Journal of Materials Chemistry 22 (30), 15153-15159, 2012
Catalytic behavior of 3-mercapto-1-propane sulfonic acid on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization
JJ Kim, SK Kim, YS Kim
Journal of electroanalytical chemistry 542, 61-66, 2003
Cationic surfactants for the control of overfill bumps in Cu superfilling
SK Kim, D Josell, TP Moffat
Journal of The Electrochemical Society 153 (12), C826, 2006
Superfilling Evolution in Cu Electrodeposition: Dependence on the Aging Time of the Accelerator
SK Kim, JJ Kim
Electrochemical and solid state letters 7 (9), C98, 2004
Electrochemical CO2 reduction to CO on dendritic Ag–Cu electrocatalysts prepared by electrodeposition
J Choi, MJ Kim, SH Ahn, I Choi, JH Jang, YS Ham, JJ Kim, SK Kim
Chemical Engineering Journal 299, 37-44, 2016
Fading mechanisms of carbon-coated and disproportionated Si/SiOx negative electrode (Si/SiOx/C) in Li-ion secondary batteries: Dynamics and component analysis by TEM
I Choi, MJ Lee, SM Oh, JJ Kim
Electrochimica acta 85, 369-376, 2012
Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS)
CH Lee, SC Lee, JJ Kim
Electrochimica acta 50 (16-17), 3563-3568, 2005
Enhanced catalytic activity of electrodeposited Ni-Cu-P toward oxygen evolution reaction
BK Kim, SK Kim, SK Cho, JJ Kim
Applied Catalysis B: Environmental 237, 409-415, 2018
The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation
MS Kang, SK Kim, K Kim, JJ Kim
Thin Solid Films 516 (12), 3761-3766, 2008
Superconformal Cu Electrodeposition Using DPS: A Substitutive Accelerator for Bis (3-sulfopropyl) Disulfide
SK Cho, SK Kim, JJ Kim
Journal of the Electrochemical Society 152 (5), C330, 2005
Hydrogen production by auto-thermal reforming of ethanol over Ni/γ-Al2O3 catalysts: Effect of second metal addition
MH Youn, JG Seo, P Kim, JJ Kim, HI Lee, IK Song
Journal of Power sources 162 (2), 1270-1274, 2006
Optimized surface pretreatments for copper electroplating
JJ Kim, SK Kim
Applied surface science 183 (3-4), 311-318, 2001
Cu bottom-up filling for through silicon vias with growing surface established by the modulation of leveler and suppressor
MJ Kim, HC Kim, S Choe, JY Cho, D Lee, I Jung, WS Cho, JJ Kim
Journal of the Electrochemical Society 160 (12), D3221, 2013
Hydrogen production by steam reforming of liquefied natural gas (LNG) over mesoporous nickel–alumina xerogel catalysts: effect of nickel content
JG Seo, MH Youn, HI Lee, JJ Kim, E Yang, JS Chung, P Kim, IK Song
Chemical Engineering Journal 141 (1-3), 298-304, 2008
Investigation of copper deposition in the presence of benzotriazole
JJ Kim, SK Kim, JU Bae
Thin Solid Films 415 (1-2), 101-107, 2002
Silicon-based miniaturized-reformer for portable fuel cell applications
OJ Kwon, SM Hwang, JG Ahn, JJ Kim
Journal of power sources 156 (2), 253-259, 2006
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