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Christian Weis
Christian Weis
University of Kaiserslautern
Verified email at weiscon.de
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The gem5 simulator: Version 20.0+
J Lowe-Power, AM Ahmad, A Akram, M Alian, R Amslinger, M Andreozzi, ...
arXiv preprint arXiv:2007.03152, 2020
2382020
DRAMPower: Open-source DRAM power & energy estimation tool
K Chandrasekar, C Weis, Y Li, B Akesson, N Wehn, K Goossens
URL: http://www. drampower. info 22, 2012
1912012
Energy and performance exploration of accelerator coherency port using Xilinx ZYNQ
M Sadri, C Weis, N Wehn, L Benini
Proceedings of the 10th FPGAworld Conference, 1-8, 2013
1032013
Exploiting expendable process-margins in DRAMs for run-time performance optimization
K Chandrasekar, S Goossens, C Weis, M Koedam, B Akesson, N Wehn, ...
2014 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2014
962014
A 2.15 GBit/s turbo code decoder for LTE advanced base station applications
T Ilnseher, F Kienle, C Weis, N Wehn
2012 7th International Symposium on Turbo Codes and Iterative Information …, 2012
802012
DRAMSys: A flexible DRAM subsystem design space exploration framework
M Jung, C Weis, N Wehn
IPSJ Transactions on System and LSI Design Methodology 8, 63-74, 2015
732015
Design space exploration for 3D-stacked DRAMs
C Weis, N Wehn, L Igor, L Benini
2011 Design, Automation & Test in Europe, 1-6, 2011
652011
Semiconductor memory and method for adapting the phase relationship between a clock signal and strobe signal during the acceptance of write data to be transmitted
G Braun, E Plaettner, C Weis, A Jakobs
US Patent 7,457,174, 2008
632008
Approximate computing with partially unreliable dynamic random access memory-approximate DRAM
M Jung, DM Mathew, C Weis, N Wehn
Proceedings of the 53rd Annual Design Automation Conference, 1-4, 2016
552016
TLM modelling of 3D stacked wide I/O DRAM subsystems: a virtual platform for memory controller design space exploration
M Jung, C Weis, N Wehn, K Chandrasekar
Proceedings of the 2013 Workshop on Rapid Simulation and Performance …, 2013
532013
Omitting refresh: A case study for commodity and wide i/o drams
M Jung, É Zulian, DM Mathew, M Herrmann, C Brugger, C Weis, N Wehn
Proceedings of the 2015 International Symposium on Memory Systems, 85-91, 2015
522015
Exploration and optimization of 3-D integrated DRAM subsystems
C Weis, I Loi, L Benini, N Wehn
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013
452013
Resilience Articulation Point (RAP): Cross-layer dependability modeling for nanometer system-on-chip resilience
A Herkersdorf, H Aliee, M Engel, M Glaß, C Gimmler-Dumont, J Henkel, ...
Microelectronics Reliability 54 (6-7), 1066-1074, 2014
412014
Method and circuit arrangement for controlling write access to a semiconductor memory
S Dietrich, T Hein, P Schroegmeier, C Weis
US Patent 7,224,625, 2007
412007
Reverse engineering of DRAMs: Row hammer with crosshair
M Jung, CC Rheinländer, C Weis, N Wehn
Proceedings of the Second International Symposium on Memory Systems, 471-476, 2016
402016
Energy optimization in 3D MPSoCs with wide-I/O DRAM using temperature variation aware bank-wise refresh
M Sadri, M Jung, C Weis, N Wehn, L Benini
2014 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-4, 2014
382014
Retention time measurements and modelling of bit error rates of WIDE I/O DRAM in MPSoCs
C Weis, M Jung, P Ehses, C Santos, P Vivet, S Goossens, M Koedam, ...
2015 Design, Automation & Test in Europe Conference & Exhibition (DATE), 495-500, 2015
372015
Towards variation-aware system-level power estimation of DRAMs: an empirical approach
K Chandrasekar, C Weis, B Akesson, N Wehn, K Goossens
Proceedings of the 50th Annual Design Automation Conference, 1-8, 2013
362013
A cross-layer technology-based study of how memory errors impact system resilience
VB Kleeberger, C Gimmler-Dumont, C Weis, A Herkersdorf, ...
IEEE Micro 33 (4), 46-55, 2013
352013
System and circuit level power modeling of energy-efficient 3D-stacked wide I/O DRAMs
K Chandrasekar, C Weis, B Akesson, N Wehn, K Goossens
2013 Design, Automation & Test in Europe Conference & Exhibition (DATE), 236-241, 2013
352013
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