| Photofunctional Construct That Interfaces Molecular Cobalt-Based Catalysts for H2 Production to a Visible-Light-Absorbing Semiconductor A Krawicz, J Yang, E Anzenberg, J Yano, ID Sharp, GF Moore Journal of the American Chemical Society 135 (32), 11861-11868, 2013 | 172 | 2013 |
| Synthesis of polysiloxane stabilized palladium colloids and evidence of their participation in silaesterification reactions BPS Chauhan, JS Rathore, M Chauhan, A Krawicz Journal of the American Chemical Society 125 (10), 2876-2877, 2003 | 91 | 2003 |
| Using molecular design to control the performance of hydrogen-producing polymer-brush-modified photocathodes D Cedeno, A Krawicz, P Doak, M Yu, JB Neaton, GF Moore The Journal of Physical Chemistry Letters 5 (18), 3222-3226, 2014 | 69 | 2014 |
| Energetics and efficiency analysis of a cobaloxime-modified semiconductor under simulated air mass 1.5 illumination A Krawicz, D Cedeno, GF Moore Physical Chemistry Chemical Physics 16 (30), 15818-15824, 2014 | 66 | 2014 |
| Thickness, Surface Morphology, and Optical Properties of Porphyrin Multilayer Thin Films Assembled on Si (100) Using Copper (I)-Catalyzed Azide− Alkyne Cycloaddition PKB Palomaki, A Krawicz, PH Dinolfo Langmuir 27 (8), 4613-4622, 2011 | 52 | 2011 |
| Layer-by-layer assembly of Zn (II) and Ni (II) 5, 10, 15, 20-tetra (4-ethynylphenyl) porphyrin multilayers on Au using copper catalyzed azide-alkyne cycloaddition A Krawicz, J Palazzo, GC Wang, PH Dinolfo RSC advances 2 (19), 7513-7522, 2012 | 28 | 2012 |
| Hybrid photocathodes for solar fuel production: coupling molecular fuel-production catalysts with solid-state light harvesting and conversion technologies D Cedeno, A Krawicz, GF Moore Interface Focus 5 (3), 20140085, 2015 | 19 | 2015 |
| Outlook for high-NA EUV patterning: a holistic patterning approach to address upcoming challenges A Raley, L Huli, S Grzeskowiak, K Lutker-Lee, A Krawicz, Y Feurprier, ... Advanced Etch Technology and Process Integration for Nanopatterning XI 12056 …, 2022 | 17 | 2022 |
| EUV Metal Oxide Resist Development Technology for Improved Sensitivity, Roughness and Pattern Collapse Margin for High Volume Manufacturing CQ Dinh, S Nagahara, Y Kuwahara, A Dauendorffer, K Yoshida, S Okada, ... Journal of Photopolymer Science and Technology 35 (1), 87-93, 2022 | 9 | 2022 |
| Second-generation radiation sensitive developable bottom anti-reflective coatings (DBARC) and implant resists approaches for 193-nm lithography F Houlihan, A Dioses, M Toukhy, A Romano, J Oberlander, HP Wu, ... Advances in Resist Materials and Processing Technology XXIV 6519, 226-233, 2007 | 7 | 2007 |
| Temperature-dependent and bistable current–voltage measurements in zinc porphyrin molecular junctions S Saha, A Nicolaı̈, JR Owens, A Krawicz, PH Dinolfo, V Meunier, ... ACS Applied Materials & Interfaces 7 (19), 10085-10090, 2015 | 6 | 2015 |
| Approaches for 193 nm and 248 nm First and Second Generation Radiation Sensitive Developable Bottom Anti Reflective Coatings (DBARC) F Houlihan, S Miyazaki, A Dioses, L Zhang, Y Ubayashi, K Ohta, ... Journal of Photopolymer Science and Technology 21 (3), 383-392, 2008 | 6 | 2008 |
| Holistic litho-etch development to address patterning challenges towards high NA EUV S Nagahara, A Dauendorffer, X Liu, T Onitsuka, H Genjima, N Nagamine, ... International Conference on Extreme Ultraviolet Lithography 2022, PC122920N, 2022 | 3 | 2022 |
| Advanced development for contact-holes of metal-oxide resists CQ Dinh, S Nagahara, K Kato, S Kawakami, Y Kuwahara, S Okada, ... International Conference on Extreme Ultraviolet Lithography 2023 12750, 2023 | 2 | 2023 |
| Coater/developer-based patterning techniques to achieve tight pitches with 0.33 NA single exposure K Kato, L Huli, N Antonovich, D Hetzer, A Krawicz, N Bae, E Liu, A Ko, ... International Conference on Extreme Ultraviolet Lithography 2023 12750, 2023 | 2 | 2023 |
| Coater/developer-based techniques to improve high-resolution EUV patterning K Kato, L Huli, D Hetzer, S Grzeskowiak, A Krawicz, N Bae, S Shimura, ... International Conference on Extreme Ultraviolet Lithography 2022, PC122920Q, 2022 | 2 | 2022 |
| Second-generation radiation sensitive 193-nm developable bottom antireflective coatings (DBARC): recent results F Houlihan, A Dioses, L Zhang, J Oberlander, A Krawicz, S Vasanthan, ... Advances in Resist Materials and Processing Technology XXV 6923, 935-941, 2008 | 2 | 2008 |
| Effect of resist surface characteristics on film-pulling velocity in immersion lithography S Schuetter, T Shedd, G Nellis, A Romano, R Dammel, M Padmanaban, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2006 | 2 | 2006 |
| Challenges and innovations in EUV patterning: lithography and etch outlook E Liu, AC Ko, S Thibaut, K Lutker-Lee, S Grzeskowiak, A Krawicz, C Cole, ... Advanced Etch Technology and Process Integration for Nanopatterning XII …, 2023 | 1 | 2023 |
| Implant Resist Approaches for 193nm Second Generation Radiation Sensitive Developable Bottom Anti Reflective Coating F Houlihan, A Dioses, M Toukhy, A Romano, J Oberlander, HP Wu, ... Journal of Photopolymer Science and Technology 20 (3), 359-364, 2007 | 1 | 2007 |
Peter H. DinolfoAssoc. Professor of Chemistry & Chemical Biology, Rensselaer Polytechnic InstituteVerified email at rpi.edu
