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Co-authors
- Kyoung-sik (Jack) MoonGeorgia Institute of TechnologyVerified email at mse.gatech.edu
- Chia-Chi TuanIntel CorporationVerified email at gatech.edu
- Ziyin LinIntel CorporationVerified email at gatech.edu
- Chia-Yun ChenProfessor, Department of Materials Science and Engineering, National Cheng Kung UniversityVerified email at mail.ncku.edu.tw
- taoran lePh.D. of Electronic Engineering, Georgia Institute of TechnologyVerified email at ece.gatech.edu
- Manos TentzerisGeorgia TechVerified email at ece.gatech.edu
- Yuntong ZhuTesla, MITVerified email at tesla.com
- Zhiqun LinNational University of SingaporeVerified email at nus.edu.sg
- Bo LiKennesaw State UniversityVerified email at kennesaw.edu
- Ting LeiSchool of Materials Science and Engineering, Peking UniversityVerified email at pku.edu.cn
- Benoit HamelinDirector of Microsystems, EngeniusMicro, Atlanta, GAVerified email at engeniusmicro.com
- Dr. Farrokh AyaziDirector, Center for MEMS and Microsystems Technologies, Georgia Institute of TechnologyVerified email at gatech.edu
- Parthasarathi ChakrabortiIntel Corporation, Georgia Institute of Technology, North Carolina State UniversityVerified email at gatech.edu
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Liyi Li
Sr. Materials and Failure Analysis Engineer, Intel Corporation
Verified email at gatech.edu