| Super Flexible, Highly Conductive Electrical Compositor Hybridized from Polyvinyl Alcohol and Silver Nano Wires HW Cui, J Jiu, K Suganuma, H Uchida RSC Advances 5 (10), 7200-7207, 2015 | 94* | 2015 |
| Highly Stretchable, Electrically Conductive Textiles Fabricated from Silver Nanowires and Cupro Fabrics Using a Simple Dipping-Drying Method HW Cui, K Suganuma, H Uchida | 84 | 2015 |
| Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics HW Cui, JT Jiu, S Nagao, T Sugahara, K Suganuma, H Uchida, ... Rsc Advances 4 (31), 15914-15922, 2014 | 66 | 2014 |
| High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic … HW Cui, A Kowalczyk, DS Li, Q Fan International Journal of Adhesion and Adhesives 44, 220-225, 2013 | 62 | 2013 |
| Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging HW Cui, DS Li, Q Fan, HX Lai International Journal of Adhesion and Adhesives 44, 232-236, 2013 | 52 | 2013 |
| Using the Friedman method to study the thermal degradation kinetics of photonically cured electrically conductive adhesives HW Cui, JT Jiu, T Sugahara, S Nagao, K Suganuma, H Uchida, ... Journal of Thermal Analysis and Calorimetry 119 (1), 425-433, 2015 | 47 | 2015 |
| Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro‐silver flakes and nano‐silver spheres for electronic packaging H Cui, Q Fan, D Li Polymer international 62 (11), 1644-1651, 2013 | 40 | 2013 |
| Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package HW Cui, Q Fan, DS Li International Journal of Adhesion and Adhesives 48, 177-182, 2014 | 35 | 2014 |
| Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives HW Cui, DS Li, Q Fan Electronic Materials Letters 9, 299-307, 2013 | 29 | 2013 |
| Nanocomposites of polybenzoxazine and exfoliated montmorillonite using a polyhedral oligomeric silsesquioxane surfactant and click chemistry HW Cui, SW Kuo Journal of Polymer Research 20 (4), 114, 2013 | 29 | 2013 |
| Preparation and characterization of exfoliated nanocomposite of polyvinyl acetate and organic montmorillonite HW Cui, GB Du Advances in Polymer Technology 31 (2), 130-140, 2012 | 29 | 2012 |
| Surface wettability, surface free energy, and surface adhesion of microwave plasma-treated Pinus yunnanensis wood Q Fang, HW Cui, GB Du Wood science and technology 50, 285-296, 2016 | 24 | 2016 |
| Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives H Cui, D Li, Q Fan Electronic Materials Letters 9, 1-5, 2013 | 24 | 2013 |
| 木材阻燃研究进展 崔会旺， 杜官本 世界林业研究 21 (3), 43-48, 2008 | 24 | 2008 |
| High Performance Heat Curing Copper-Silver Powders Filled Electrically Conductive Adhesives HW Cui, JT Jiu, T Sugahara, S Nagao, K Suganuma, H Uchida, ... Electronic Materials Letters, 2015 | 23 | 2015 |
| Formulation and characterization of electrically conductive adhesives for electronic packaging H Cui, Q Fan, D Li, X Tang The Journal of Adhesion 89 (1), 19-36, 2013 | 23 | 2013 |
| Preparation and characterization of PVAc-MMT-DOAB H Cui, G Du High Performance Polymers 23 (1), 40-48, 2011 | 23 | 2011 |
| Using the Ozawa Method to Study the Thermally Initiated Curing Kinetics of Vinyl Ester Resin HW Cui, K Suganuma, H Uchida RSC Advances 5 (4), 2677-2683, 2015 | 22* | 2015 |
| Development of a novel polyvinyl acetate type emulsion curing agent for urea formaldehyde resin H Cui, G Du Wood science and technology 47, 105-119, 2013 | 22 | 2013 |
| Montmorillonite reinforced phenol formaldehyde resin: Preparation, characterization, and application in wood bonding Q Fang, H Cui, G Du International Journal of Adhesion and Adhesives 49, 33-37, 2014 | 20 | 2014 |
