| Printed electronics for extreme high temperature environments M Alhendi, F Alshatnawi, EM Abbara, R Sivasubramony, G Khinda, ... Additive Manufacturing 54, 102709, 2022 | 30 | 2022 |
| Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink AR Gharaibeh, YM Manaserh, MI Tradat, FW AlShatnawi, SN Schiffres, ... Journal of Electronic Packaging 144 (3), 031017, 2022 | 11 | 2022 |
| High Temperature Die Interconnection Approaches F Alshatnawi, M Alhendi, RA Al-Haidari, RS Sivasubramony, EM Abbara, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1539-1545, 2022 | 7 | 2022 |
| Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints S Thekkut, R Das, M Njuki, J Li, RS Sivasubramony, FW Alshatnawi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 485-491, 2020 | 7 | 2020 |
| Current Carrying Capacity of Inkjet-Printed Nano-Silver Interconnects on Mesoporous PET Substrate EM Abbara, GS Khinda, M Alhendi, R Alhaidari, F Alshatnawi, B Garakani, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 794-800, 2022 | 4 | 2022 |
| Fabrication, Characterization, and Electromechanical Reliability of Stretchable Circuitry for Health Monitoring Systems B Garakani, KUS Somarathna, R Al-Haidari, FW Alshatnavi, DM Smilgies, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1524-1530, 2022 | 3 | 2022 |
| High‐Temperature Oxidation‐Resistant Printed Copper Conductors S Khuje, F Alshatnawi, M Alhendi, J Yu, A Sheng, Y Huang, CG Zhuang, ... Advanced Electronic Materials 9 (3), 2200979, 2023 | 2 | 2023 |
| Electrical and Mechanical Behavior of Aerosol Jet Printed Gold on Alumina Substrate for High Temperature Applications F Alshatnawi, M Alhendi, EM Abbara, R Sivasubramony, B Garakani, ... Advanced Engineering Materials, 2300439, 2023 | 1 | 2023 |
| High stability and reliability additively manufactured metal-insulator-metal capacitors for high-temperature applications F Alshatnawi, E Enakerakpo, M Alhendi, M Abdelatty, A Umar, ... Materials Today Communications 39, 108682, 2024 | | 2024 |
| Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals S Khuje, F Alshatnawi, D Smilgies, M Alhendi, A Islam, J Armstrong, J Yu, ... Advanced Functional Materials 34 (4), 2311085, 2024 | | 2024 |
