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Kubra Sekmen
Kubra Sekmen
Verified email at polytechnique.edu
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Year
Temperature-and degree of cure-dependent viscoelastic properties of photopolymer resins used in digital light processing
T Rehbein, M Johlitz, A Lion, K Sekmen, A Constantinescu
Progress in Additive Manufacturing 6 (4), 743-756, 2021
132021
Thermal analysis and shrinkage characterization of the photopolymers for DLP additive manufacturing processes
K Sekmen, T Rehbein, M Johlitz, A Lion, A Constantinescu
Continuum Mechanics and Thermodynamics, 1-18, 2022
92022
Simplified stress analysis of multilayered adhesively bonded structures
K Sekmen, E Paroissien, F Lachaud
International Journal of Adhesion and Adhesives 97, 102497, 2020
52020
Curing-dependent thermo-viscoelastic and shrinkage behaviour of photopolymers
K Sekmen, T Rehbein, M Johlitz, A Lion, A Constantinescu
Mechanics of Materials 179, 104566, 2023
22023
Material modelling of the photopolymers for additive manufacturing processes
K Sekmen, T Rehbein, A Lion, M Johlitz, A Constantinescu
Proceedings of the 33rd Annual International Solid Freeform Fabrication …, 2022
12022
Experiments and modelling of photopolymers for 3D printing
K Sekmen
Institut Polytechnique de Paris, 2023
2023
Experimental and numerical study of the DLP 3D printed photopolymers
K Sekmen, D Weisz-Patrault, A Constantinescu
18th European Mechanics of Materials Conference (EMMC), 2022
2022
Experimental investigation and material modelling of the photopolymers for DLP additive manufacturing process
K Sekmen, T Rehbein, A Lion, M Johlitz, A Constantinescu
18th International Conference on Deformation, Yield and Fracture of Polymers …, 2022
2022
Mesure PeakForce-QNM AFM des rides de surface induites par photopolymérisation sur l'objet imprimé en 3D DLP
K Sekmen, X Chang, S Hallais, K Danas, A Constantinescu
30ème Colloque National sur la Deformation des Polymères Solides (DEPOS 30), 2021
2021
Simplified stress analysis of multilayered adhesively bonded metallic structures
K Sekmen, E Paroissien, F Lachaud
5th International Conference on Structural Adhesive Bonding (AB2019), 2019
2019
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