Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits I De Wolf Semiconductor science and technology 11 (2), 139, 1996 | 1254 | 1996 |
Stress measurements in silicon devices through Raman spectroscopy: Bridging the gap between theory and experiment I De Wolf, HE Maes, SK Jones Journal of Applied Physics 79 (9), 7148-7156, 1996 | 426 | 1996 |
Design issues and considerations for low-cost 3-D TSV IC technology G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ... IEEE Journal of Solid-State Circuits 46 (1), 293-307, 2010 | 394 | 2010 |
A comprehensive model to predict the charging and reliability of capacitive RF MEMS switches WM Van Spengen, R Puers, R Mertens, I De Wolf Journal of Micromechanics and Microengineering 14 (4), 514, 2004 | 310 | 2004 |
A physical model to predict stiction in MEMS WM Van Spengen, R Puers, I De Wolf Journal of micromechanics and microengineering 12 (5), 702, 2002 | 291 | 2002 |
Stress measurements in Si microelectronics devices using Raman spectroscopy I De Wolf Journal of Raman spectroscopy 30 (10), 877-883, 1999 | 263 | 1999 |
Optical inspection of Microsystems W Osten, A Duparre, C Furlong, I De Wolf, A Asundi, K Korner, D Vogel, ... CRC press, 2018 | 246 | 2018 |
Micro‐Raman study of stress distribution in local isolation structures and correlation with transmission electron microscopy I De Wolf, J Vanhellemont, A Romano‐Rodríguez, H Norström, HE Maes Journal of Applied Physics 71 (2), 898-906, 1992 | 197 | 1992 |
Printed circuit board technology inspired stretchable circuits J Vanfleteren, M Gonzalez, F Bossuyt, YY Hsu, T Vervust, I De Wolf, ... MRS bulletin 37 (3), 254-260, 2012 | 169 | 2012 |
Analytical model of the DC actuation of electrostatic MEMS devices with distributed dielectric charging and nonplanar electrodes X Rottenberg, I De Wolf, BKJC Nauwelaers, W De Raedt, HAC Tilmans Journal of Microelectromechanical Systems 16 (5), 1243-1253, 2007 | 165 | 2007 |
Stresses and strains in lattice‐mismatched stripes, quantum wires, quantum dots, and substrates in Si technology SC Jain, HE Maes, K Pinardi, I De Wolf Journal of applied physics 79 (11), 8145-8165, 1996 | 158 | 1996 |
Fabrication and reliability testing of Ti/TiN heaters P De Moor, A Witvrouw, V Simons, I De Wolf Micromachining and Microfabrication Process Technology V 3874, 284-293, 1999 | 148 | 1999 |
Cu pumping in TSVs: Effect of pre-CMP thermal budget I De Wolf, K Croes, OV Pedreira, R Labie, A Redolfi, M Van De Peer, ... Microelectronics Reliability 51 (9-11), 1856-1859, 2011 | 143 | 2011 |
Study of damage and stress induced by backgrinding in Si wafers J Chen, I De Wolf Semiconductor science and technology 18 (4), 261, 2003 | 141 | 2003 |
Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k/metal gate CMOS performance A Mercha, G Van der Plas, V Moroz, I De Wolf, P Asimakopoulos, N Minas, ... 2010 International Electron Devices Meeting, 2.2. 1-2.2. 4, 2010 | 140 | 2010 |
On the physics of stiction and its impact on the reliability of microstructures WM Van Spengen, R Puers, I De Wolf Journal of adhesion science and technology 17 (4), 563-582, 2003 | 133 | 2003 |
Raman spectroscopy: Chips and stress I De Wolf Spectroscopy Europe 15 (2), 6-13, 2003 | 128 | 2003 |
Strain determination in silicon microstructures by combined convergent beam electron diffraction, process simulation, and micro-Raman spectroscopy V Senez, A Armigliato, I De Wolf, G Carnevale, R Balboni, S Frabboni, ... Journal of Applied Physics 94 (9), 5574-5583, 2003 | 125 | 2003 |
Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization YY Hsu, M Gonzalez, F Bossuyt, J Vanfleteren, I De Wolf IEEE transactions on electron devices 58 (8), 2680-2688, 2011 | 124 | 2011 |
The investigation of microsystems using Raman spectroscopy I De Wolf, C Jian, WM van Spengen Optics and Lasers in Engineering 36 (2), 213-223, 2001 | 103 | 2001 |