| Evaluation of residual stress levels in plasma electrolytic oxidation coatings using a curvature method J Dean, T Gu, TW Clyne Surface and coatings technology 269, 47-53, 2015 | 55 | 2015 |
| Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5 Cu solder Y Xu, T Gu, J Xian, F Giuliani, TB Britton, CM Gourlay, FPE Dunne International Journal of Plasticity 137, 102904, 2021 | 23 | 2021 |
| In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5 Cu/Cu solder joint T Gu, Y Xu, CM Gourlay, TB Britton Scripta Materialia 175, 55-60, 2020 | 20 | 2020 |
| In-situ study of creep in Sn-3Ag-0.5 Cu solder T Gu, VS Tong, CM Gourlay, TB Britton Acta Materialia 196, 31-43, 2020 | 16 | 2020 |
| The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures T Gu, CM Gourlay, TB Britton Journal of Electronic Materials volume 50 (3), 926–938, 2021 | 13 | 2021 |
| Evaluating creep deformation in controlled microstructures of Sn-3Ag-0.5 Cu solder T Gu, CM Gourlay, TB Britton Journal of Electronic Materials 48 (1), 107-121, 2019 | 12 | 2019 |
| Multi-scale plasticity homogenization of Sn–3Ag-0.5 Cu: From β-Sn micropillars to polycrystals with intermetallics Y Xu, T Gu, J Xian, F Giuliani, TB Britton, CM Gourlay, FPE Dunne Materials Science and Engineering: A 855, 143876, 2022 | 3 | 2022 |
| Accessing slip activity in high purity tin with electron backscatter diffraction and measurement of slip strength T Gu, F Giuliani, TB Britton arXiv preprint arXiv:2104.02681, 2021 | 1 | 2021 |
| Observations of microstructure evolution and damage of SAC305 solder alloys during thermal and mechanical loadings T Gu Imperial College London, 2018 | | 2018 |
Ben BrittonDepartment of Materials Engineering, University of British ColumbiaVerified email at ubc.ca
