Anson Heryanto
Anson Heryanto
Global Foundries Singapore
Verified email at e.ntu.edu.sg
TitleCited byYear
Effect of copper TSV annealing on via protrusion for TSV wafer fabrication
A Heryanto, WN Putra, A Trigg, S Gao, WS Kwon, FX Che, XF Ang, J Wei, ...
Journal of electronic materials 41 (9), 2533-2542, 2012
1132012
Study on Cu protrusion of through-silicon via
FX Che, WN Putra, A Heryanto, A Trigg, X Zhang, CL Gan
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013
612013
The effect of stress migration on electromigration in dual damascene copper interconnects
A Heryanto, KL Pey, YK Lim, W Liu, N Raghavan, J Wei, CL Gan, MK Lim, ...
Journal of Applied Physics 109 (1), 013716, 2011
202011
Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)
FX Che, WN Putra, A Heryanto, A Trigg, S Gao, CL Gan
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE …, 2011
122011
Study of stress migration and electromigration interaction in copper/low-κ interconnects
A Heryanto, KL Pey, YK Lim, W Liu, J Wei, N Raghavan, JB Tan, DK Sohn
2010 IEEE International Reliability Physics Symposium, 586-590, 2010
52010
Stress migration risk on electromigration reliability in advanced narrow line copper interconnects
A Heryanto, KL Pey, YK Lim, N Raghavan, W Liu, J Wei, CL Gan, JB Tan
Journal of Applied Physics 110 (8), 083702, 2011
22011
The effects of dielectric slots on Copper/Low-k interconnects reliability
A Heryanto, YK Lim, KL Pey, W Liu, JB Tan, DK Sohn, LC Hsia
2009 IEEE International Interconnect Technology Conference, 92-94, 2009
12009
Method for making non-volatile memory device
A Heryanto, EH Toh, SUN Yongshun, YL Lim, SL Chwa
US Patent 10,475,803, 2019
2019
Effect of stress migration on electromigration for nano scale advanced interconnects
A Heryanto
2012
Microstructural Evolution of Copper TSV During Annealing and its Effect on the Via Protrusion for TSV Wafer Fabrication
A Heryanto, WN Putra, A Trigg, S Gao, FX Che, WS Kwon, XF Ang, J Wei, ...
International Conference on Materials for Advanced Technology (ICMAT), 2011
2011
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