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Roozbeh Danaei
Roozbeh Danaei
R&D Engineer, Intel Corporation
Verified email at intel.com
Title
Cited by
Cited by
Year
Ultrafast fabrication of thermoelectric films by pulsed light sintering of colloidal nanoparticles on flexible and rigid substrates
R Danaei, T Varghese, M Ahmadzadeh, J McCloy, C Hollar, ...
Advanced Engineering Materials 21 (1), 1800800, 2019
382019
Manufacturing PDMS micro lens array using spin coating under a multiphase system
R Sun, H Yang, DM Rock, R Danaei, R Panat, MR Kessler, L Li
Journal of Micromechanics and Microengineering 27 (5), 055012, 2017
132017
Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review
DPR Thanu, A Antoniswamy, R Danaei, M Keswani
Reviews of Adhesion and Adhesives 6 (1), 1-25, 2018
42018
Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review
DPR Thanu, A Antoniswamy, R Danaei, M Keswani
Progress in Adhesion and Adhesives 4, 1-24, 2019
32019
Fundamental study of polymer to metal bonding in integrated circuit packaging
DPR Thanu, R Danaei, A Bermudez, SA Chan, S Prstic
International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018
12018
Ultrafast pulsed light sintering of thermoelectric nanoparticles
R Danaei
Washington State University, 2017
2017
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Articles 1–6