| Atomic layer deposition for fabricating thin films AP Paranjpe, S Gopinath, TR Omstead, RS Bubber, M Mao US Patent 7,037,574, 2006 | 651 | 2006 |
| Method and apparatus for layer by layer deposition of thin films AP Paranjpe US Patent 7,393,561, 2008 | 626 | 2008 |
| Linear Cluster Deposition System WE Quinn, A Gurary, A Paranjpe, MD Ferreira, RP Fremgen Jr, EA Armour US Patent App. 12/877,775, 2012 | 454 | 2012 |
| A tuned Langmuir probe for measurements in rf glow discharges AP Paranjpe, JP McVittie, SA Self Journal of Applied Physics 67 (11), 6718-6727, 1990 | 238 | 1990 |
| Self-guided, self-propelled, convertible cleaning apparatus AP Paranjpe US Patent 5,634,237, 1997 | 221 | 1997 |
| System for Fabricating a Pattern on Magnetic Recording Media A Paranjpe, TA Luse, RP Fremgen, N Srinivasan, BL Druz, K Rook, ... US Patent App. 13/392,246, 2012 | 196 | 2012 |
| Method for cleaning semiconductor wafers using liquified gases AP Paranjpe US Patent 5,494,526, 1996 | 170 | 1996 |
| Low temperature sin deposition methods A Paranjpe, K Zhang, B McDougall, W Vereb, M Patten, A Goldman, ... US Patent App. 10/970,317, 2006 | 147 | 2006 |
| Atomic layer deposition of AlOx for thin film head gap applications A Paranjpe, S Gopinath, T Omstead, R Bubber Journal of the Electrochemical Society 148 (9), G465, 2001 | 133 | 2001 |
| Structure and method for incorporating an inductively coupled plasma source in a plasma processing chamber AP Paranjpe, CJ Davis, RT Matthews US Patent 5,580,385, 1996 | 125 | 1996 |
| Apparatus and method for in-situ deep ultraviolet photon-assisted semiconductor wafer processing MM Moslehi, AP Paranjpe, CJ Davis US Patent 5,217,559, 1993 | 121 | 1993 |
| Microelectronic interconnect material with adhesion promotion layer and fabrication method AP Paranjpe, MM Moslehi, B Relja, RS Bubber, LA Velo, TR Omstead, ... US Patent 6,365,502, 2002 | 110 | 2002 |
| Single-wafer integrated semiconductor device processing MM Moslehi, RA Chapman, M Wong, A Paranjpe, HN Najm, J Kuehne, ... IEEE transactions on electron devices 39 (1), 4-32, 1992 | 107 | 1992 |
| Method for planarization AP Paranjpe US Patent 5,434,107, 1995 | 105 | 1995 |
| Plasma source and method of manufacturing AP Paranjpe US Patent 5,231,334, 1993 | 103 | 1993 |
| Semiconductor chip interconnect barrier material and fabrication method AP Paranjpe, MM Moslehi, RS Bubber, LA Velo US Patent 6,294,836, 2001 | 100 | 2001 |
| RF induction plasma source for plasma processing AP Paranjpe US Patent 5,430,355, 1995 | 97 | 1995 |
| 45‐2: Invited Paper: Micro‐LED Displays: Key Manufacturing Challenges and Solutions A Paranjpe, J Montgomery, SM Lee, C Morath SID Symposium Digest of Technical Papers 49 (1), 597-600, 2018 | 92 | 2018 |
| Microelectronic interconnect material with adhesion promotion layer and fabrication method AP Paranjpe, MM Moslehi, B Relja, RS Bubber, LA Velo, TR Omstead, ... US Patent 6,645,847, 2003 | 87 | 2003 |
| Method for forming a copper film on a substrate AP Paranjpe, MM Moslehi, LA Velo, TR Omstead, DR Campbell Sr, Z Liu, ... US Patent 6,461,675, 2002 | 79 | 2002 |
