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Co-authors
- Dr. Mohammad MotalabProfessor of Mechanical Engineering, Bangladesh University of Engineering and TechnologyVerified email at me.buet.ac.bd
- Rafsan Al Shafatul Islam SubadResearch Assistant, University of Maryland College ParkVerified email at umd.edu
- Tanmay Sarkar AkashUniversity of MarylandVerified email at umd.edu
- Md Mahbubul IslamAssistant Professor of Mechanical Engineering, Wayne State UniversityVerified email at wayne.edu
- Tawfiqur RakibPost-doctoral researcher, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Jeffrey C. SuhlingAuburn University, Department of Mechanical EngineeringVerified email at auburn.edu
- Turash Haque PialPostdoctoral scholar, Johns Hopkins UniversityVerified email at jh.edu
- Satyajit MojumderNorthwestern University, Bangladesh University of Engineering and Technology (BUET)Verified email at u.northwestern.edu
- Ratul PaulDepartment of Mechanical Engineering & Mechanics, Lehigh UniversityVerified email at lehigh.edu
- Khan Rabbi, Ph.D.Packaging R&D Engineer (Thermal Fluids) at Intel CorporationVerified email at intel.com
- Sourav DasPurdue University, The Ohio State University, Bangladesh University of Engineering and TechnologyVerified email at purdue.edu