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Taeyoung Kim
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Analytical modeling and characterization of electromigration effects for multibranch interconnect trees
HB Chen, SXD Tan, X Huang, T Kim, V Sukharev
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2016
632016
Recent advances in EM and BTI induced reliability modeling, analysis and optimization
SXD Tan, H Amrouch, T Kim, Z Sun, C Cook, J Henkel
Integration, the VLSI Journal, 2017
512017
Battery management and application for energy-efficient buildings
T Wei, T Kim, S Park, Q Zhu, SXD Tan, N Chang, S Ula, M Maasoumy
Proceedings of the 51st Annual Design Automation Conference, 1-6, 2014
452014
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing
X Huang, V Sukharev, T Kim, H Chen, SXD Tan
2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), 244-249, 2016
432016
Analytical modeling of electromigration failure for VLSI interconnect tree considering temperature and segment length effects
HB Chen, SXD Tan, J Peng, T Kim, J Chen
IEEE Transactions on Device and Materials Reliability 17 (4), 653-666, 2017
402017
Voltage-based electromigration immortality check for general multi-branch interconnects
Z Sun, E Demircan, MD Shroff, T Kim, X Huang, SXD Tan
2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-7, 2016
382016
Learning-based dynamic reliability management for dark silicon processor considering EM effects
T Kim, X Huang, HB Chen, V Sukharev, SXD Tan
2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), 463-468, 2016
302016
Detecting and preventing forward head posture with wireless inertial body sensor networks
T Kim, S Chen, J Lach
2011 International Conference on Body Sensor Networks, 125-126, 2011
292011
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing
X Huang, V Sukharev, T Kim, SXD Tan
Integration 58, 518-527, 2017
272017
Energy and lifetime optimizations for dark silicon manycore microprocessor considering both hard and soft errors
T Kim, Z Sun, HB Chen, H Wang, SXD Tan
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (9 …, 2017
252017
Longitudinal high-fidelity gait analysis with wireless inertial body sensors
AT Barth, B Boudaoud, JS Brantley, S Chen, CL Cunningham, T Kim, ...
Wireless Health 2010, 192-193, 2010
242010
Long-Term Reliability of Nanometer VLSI Systems
S Tan, M Tahoori, T Kim, S Wang, Z Sun, S Kiamehr
232019
Interconnect reliability modeling and analysis for multi-branch interconnect trees
HB Chen, SXD Tan, V Sukharev, X Huang, T Kim
Proceedings of the 52nd Annual Design Automation Conference, 1-6, 2015
232015
Finite difference method for electromigration analysis of multi-branch interconnects
C Cook, Z Sun, T Kim, SXD Tan
2016 13th International Conference on Synthesis, Modeling, Analysis and …, 2016
222016
Characterizing and minimizing synchronization and calibration errors in inertial body sensor networks.
S Chen, JS Brantley, T Kim, JC Lach
BodyNets, 138-144, 2010
202010
Electromigration assessment for power grid networks considering temperature and thermal stress effects
X Huang, V Sukharev, JH Choy, M Chew, T Kim, SXD Tan
Integration 55, 307-315, 2016
192016
Characterising and minimising sources of error in inertial body sensor networks
S Chen, JS Brantley, T Kim, SA Ridenour, J Lach
International Journal of Autonomous and Adaptive Communications Systems 6 (3 …, 2013
182013
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs
S Wang, T Kim, Z Sun, SXD Tan, MB Tahoori
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2017
112017
Dynamic reliability management for near-threshold dark silicon processors
T Kim, Z Sun, C Cook, J Gaddipati, H Wang, H Chen, SXD Tan
2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-7, 2016
112016
Lifetime optimization for real-time embedded systems considering electromigration effects
T Kim, B Zheng, HB Chen, Q Zhu, V Sukharev, SXD Tan
2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 434-439, 2014
112014
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