Myung Jun Kim
Myung Jun Kim
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3D printing electronic components and circuits with conductive thermoplastic filament
PF Flowers, C Reyes, S Ye, MJ Kim, BJ Wiley
Additive Manufacturing 18, 156-163, 2017
One-Dimensional Metal Nanostructures: From Colloidal Syntheses to Applications
D Huo, MJ Kim, Z Lyu, Y Shi, BJ Wiley, Y Xia
Chemical reviews 119 (15), 8972-9073, 2019
Electrochemical CO2 reduction to CO on dendritic Ag–Cu electrocatalysts prepared by electrodeposition
J Choi, MJ Kim, SH Ahn, I Choi, JH Jang, YS Ham, JJ Kim, SK Kim
Chemical Engineering Journal 299, 37-44, 2016
Effect of morphology on the electrical resistivity of silver nanostructure films
IE Stewart, MJ Kim, BJ Wiley
ACS applied materials & interfaces 9 (2), 1870-1876, 2017
Electrodeposited Ag catalysts for the electrochemical reduction of CO2 to CO
YS Ham, S Choe, MJ Kim, T Lim, SK Kim, JJ Kim
Applied Catalysis B: Environmental 208, 35-43, 2017
Cu bottom-up filling for through silicon vias with growing surface established by the modulation of leveler and suppressor
MJ Kim, HC Kim, S Choe, JY Cho, D Lee, I Jung, WS Cho, JJ Kim
Journal of the Electrochemical Society 160 (12), D3221, 2013
Ethylenediamine promotes Cu nanowire growth by inhibiting oxidation of Cu (111)
MJ Kim, PF Flowers, IE Stewart, S Ye, S Baek, JJ Kim, BJ Wiley
Journal of the American Chemical Society 139 (1), 277-284, 2017
Multigram synthesis of Cu‐Ag Core–shell nanowires enables the production of a highly conductive polymer filament for 3D printing electronics
MA Cruz, S Ye, MJ Kim, C Reyes, F Yang, PF Flowers, BJ Wiley
Particle & Particle Systems Characterization 35 (5), 1700385, 2018
Single-crystal electrochemistry reveals why metal nanowires grow
MJ Kim, S Alvarez, Z Chen, KA Fichthorn, BJ Wiley
Journal of the American Chemical Society 140 (44), 14740-14746, 2018
Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums
MJ Kim, Y Seo, HC Kim, Y Lee, S Choe, YG Kim, SK Cho, JJ Kim
Electrochimica Acta 163, 174-181, 2015
Degradation of bis (3-sulfopropyl) disulfide and its influence on copper electrodeposition for feature filling
S Choe, MJ Kim, HC Kim, SK Cho, SH Ahn, SK Kim, JJ Kim
Journal of The Electrochemical Society 160 (12), D3179, 2013
MSA as a supporting electrolyte in copper electroplating for filling of damascene trenches and through silicon vias
SK Cho, MJ Kim, JJ Kim
Electrochemical and Solid State Letters 14 (5), D52, 2011
One-step Electrodeposition of Copper on Conductive 3D Printed Objects
MJ Kim, MA Cruz, S Ye, AL Gray, GL Smith, N Lazarus, CJ Walker, ...
Additive Manufacturing 27, 318-326, 2019
Modulating the growth rate, aspect ratio, and yield of copper nanowires with alkylamines
MJ Kim, S Alvarez, T Yan, V Tadepalli, KA Fichthorn, BJ Wiley
Chemistry of Materials 30 (8), 2809-2818, 2018
The influences of iodide ion on Cu electrodeposition and TSV filling
MJ Kim, HC Kim, JJ Kim
Journal of The Electrochemical Society 163 (8), D434-D441, 2016
Bottom-up filling of through silicon vias using galvanostatic cu electrodeposition with the modified organic additives
HC Kim, S Choe, JY Cho, D Lee, I Jung, WS Cho, MJ Kim, JJ Kim
Journal of The Electrochemical Society 162 (3), D109, 2014
Atomic layer deposition of copper nitride film and its application to copper seed layer for electrodeposition
JM Park, K Jin, B Han, MJ Kim, J Jung, JJ Kim, WJ Lee
Thin Solid Films 556, 434-439, 2014
Facile formation of Cu-Ag film by electrodeposition for the oxidation-resistive metal interconnect
MJ Kim, HJ Lee, SH Yong, OJ Kwon, SK Kim, JJ Kim
Journal of The Electrochemical Society 159 (4), D253, 2012
Pulse electrodeposition for improving electrical properties of Cu thin film
MJ Kim, SK Cho, HC Koo, T Lim, KJ Park, JJ Kim
Journal of the Electrochemical Society 157 (11), D564, 2010
Electrodeposition for the fabrication of copper interconnection in semiconductor devices
MJ Kim, JJ Kim
Korean Chemical Engineering Research 52 (1), 26-39, 2014
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