| Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (< 6 µm) and Reliable Flexible Cu-Based … A Hanna, A Alam, T Fukushima, S Moran, W Whitehead, SC Jangam, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1505-1511, 2018 | 27 | 2018 |
| A flexible, heterogeneously integrated wireless powered system for bio-implantable applications using fan-out wafer-level packaging G Ezhilarasu, A Hanna, R Irwin, A Alam, SS Iyer 2018 IEEE International Electron Devices Meeting (IEDM), 29.7. 1-29.7. 4, 2018 | 24 | 2018 |
| Demonstration of a heterogeneously integrated system-on-wafer (SoW) assembly AA Bajwa, SC Jangam, S Pal, B Vaisband, R Irwin, M Goorsky, SS Iyer 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1926-1930, 2018 | 23 | 2018 |
| Heterogeneous integration of a fan-out wafer-level packaging based foldable display on elastomeric substrate A Alam, A Hanna, R Irwin, G Ezhilarasu, H Boo, Y Hu, CW Wong, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 277-282, 2019 | 17 | 2019 |
| A high spatial resolution surface electromyography (sEMG) system using fan-out wafer-level packaging on FlexTrate™ A Alam, M Molter, B Gaonkar, A Hanna, R Irwin, S Benedict, G Ezhilarasu, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 985-990, 2020 | 15 | 2020 |
| Fabrication of Flexible Li-ion Battery Electrodes Using" Battlets" Approach with Ionic Liquid Electrolyte for Powering Wearable Devices G Ouyang, G Whang, E MacInnis, H Ren, H Sun, R Irwin, B Dunn, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 780-785, 2022 | 5 | 2022 |
| Flexible connectors and PCB segmentation for signaling and power delivery in wafer-scale systems R Irwin, K Sahoo, S Pal, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 507-513, 2021 | 5 | 2021 |
| Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets K Sahoo, V Harish, JH Liu, R Irwin, CTM Yang, H Sun, SS Iyer 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1940-1946, 2024 | 3 | 2024 |
| Comprehensive investigation of in-plane and out-of-plane die shift in flexible fan-out wafer-level packaging using polydimethylsiloxane G Ouyang, A Hanna, S Benedict, G Ezhilarasu, A Alam, RW Irwin, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 3 | 2022 |
| Smartphone App-Enabled Flex sEMG Patch using FOWLP P Venkatesh, R Irwin, A Alam, M Molter, A Kapoor, B Gaonkar, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2263-2268, 2022 | 3 | 2022 |
| A Heterogeneously Integrated and Flexible Inorganic Micro-display on FlexTrate™ using Fan-Out Wafer-Level Packaging H Sun, G Ezhilarasu, G Ouyang, R Irwin, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1390-1394, 2022 | 3 | 2022 |
| TSV-less Power Delivery for Wafer-scale Assemblies and Interposers H Ren, S Pal, G Ouyang, R Irwin, YT Yang, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1934-1939, 2022 | 1 | 2022 |
| Characterization and design improvement of a high bandwidth, high frequency flexible connector for signal delivery R Irwin, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1759-1763, 2022 | 1 | 2022 |
| Reliability considerations for wafer scale systems NS Chase, R Irwin, YT Yang, H Ren, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 84-89, 2021 | 1 | 2021 |
| An active, high bandwidth, flexible connector for large area computational systems R Irwin, J Fang, SS Iyer 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1797-1803, 2024 | | 2024 |
| Advanced Packaging Methods Used for Energy Storage from Intermittent Renewable Sources T Fukushima, T Xiang, H Ranjan, N Tripathi, C Liu, G Ouyang, R Irwin, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 444-449, 2023 | | 2023 |
| Nanowire Impregnated Poly-dimethyl Siloxane for Flexible, Thermally Conductive Fan-Out Wafer-Level Packaging R Irwin, Y Hu, A Alam, S Benedict, T Fisher, SS Iyer 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1548-1553, 2020 | | 2020 |
