David Whalley
David Whalley
Verified email at lboro.ac.uk
Title
Cited by
Cited by
Year
Thermal interface materials-A review of the state of the art
F Sarvar, DC Whalley, PP Conway
2006 1st Electronic Systemintegration Technology Conference 2, 1292-1302, 2006
2362006
Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
JF Li, SH Mannan, MP Clode, DC Whalley, DA Hutt
Acta Materialia 54 (11), 2907-2922, 2006
1712006
A review of the impact of conductive adhesive technology on interconnection
AO Ogunjimi, O Boyle, DC Whalley, DJ Williams
Journal of Electronics Manufacturing 2 (03), 109-118, 1992
771992
Direct-write techniques for maskless production of microelectronics: A review of current state-of-the-art technologies
Y Zhang, C Liu, D Whalley
2009 International Conference on Electronic Packaging Technology & High …, 2009
712009
Conduction mechanisms in anisotropic conducting adhesive assembly
CN Oguibe, SH Mannan, DC Whalley, DJ Williams
Proceedings. The First IEEE International Symposium on Polymeric Electronics …, 1997
671997
Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation
DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan
IEEE transactions on components and packaging technologies 25 (1), 87-97, 2002
652002
Anisotropic conducting adhesives for electronic interconnection
DJ Williams, DC Whalley, OA Boyle, AO Ogunjimi
Soldering & Surface Mount Technology, 1993
621993
Application of adhesives in MEMS and MOEMS assembly: a review
F Sarvar, DA Hutt, DC Whalley
2nd International IEEE Conference on Polymers and Adhesives in …, 2002
612002
Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders
JF Li, SH Mannan, MP Clode, K Chen, DC Whalley, C Liu, DA Hutt
Acta materialia 55 (2), 737-752, 2007
582007
A simplified reflow soldering process model
DC Whalley
Journal of Materials Processing Technology 150 (1-2), 134-144, 2004
462004
The effects of conducting particle distribution on the behaviour of anisotropic conducting adhesives: non-uniform conductivity and shorting between connections
DJ Williams, DC Whalley
Journal of Electronics Manufacturing 3 (02), 85-94, 1993
421993
Effect of Al2O3 fibers on the thermal conductivity and mechanical properties of high density polyethylene with the absence and presence of compatibilizer
S Zhang, Y Ke, X Cao, Y Ma, F Wang
Journal of Applied Polymer Science 124 (6), 4874-4881, 2012
332012
A comparative study of the interfacial reaction between electroless Ni–P coatings and molten tin
K Chen, C Liu, DC Whalley, DA Hutt, JF Li, SH Mannan
Acta Materialia 56 (19), 5668-5676, 2008
272008
Anisotropic conducting adhesives for electronic assembly
DC Whalley, SH Mannan, DJ Williams
Assembly Automation, 1997
271997
Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating
DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan
IEEE transactions on components and packaging technologies 25 (1), 98-105, 2002
262002
A simplified model of the reflow soldering process
DC Whalley
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002
222002
Models to determine guidelines for the anisotropic conducting adhesives joining process
SH Mannan, DJ Williams, DC Whalley, AO Ogunjimi
Conductive adhesives for electronics packaging, 1999
201999
The process modelling of the infra-red reflow soldering of printed circuit board assemblies
DC WHALLEY, A OGUNJIMI, PP CONWAY, DJ WILLIAMS
Journal of Electronics Manufacturing 2 (01), 23-29, 1992
201992
Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheres
S Jain, DC Whalley, M Cottrill, H Kristiansen, K Redford, CB Nilsen, ...
18th European Microelectronics & Packaging Conference, 1-7, 2011
192011
Some optimum processing properties for anisotropic conductive adhesives for flip chip interconnection
SH Mannan, DJ Williams, DC Whalley
Journal of Materials Science: Materials in Electronics 8 (4), 223-231, 1997
191997
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Articles 1–20