| Ultrasound enhanced electrochemical oxidation of Alizarin Red S on boron doped diamond (BDD) anode: Effect of degradation process parameters C Zhu, C Jiang, S Chen, R Mei, X Wang, J Cao, L Ma, B Zhou, Q Wei, ... Chemosphere 209, 685-695, 2018 | 88 | 2018 |
| The dependence of oxidation parameters and dyes’ molecular structures on microstructure of boron-doped diamond in electrochemical oxidation process of dye wastewater R Mei, C Zhu, Q Wei, L Ma, W Li, B Zhou, Z Deng, Z Tong, G Ouyang, ... Journal of the Electrochemical Society 165 (7), H324, 2018 | 24 | 2018 |
| Mechanism and process window study for die-to-wafer (D2W) hybrid bonding H Ren, YT Yang, G Ouyang, SS Iyer ECS Journal of Solid State Science and Technology 10 (6), 064008, 2021 | 17 | 2021 |
| Fabrication of flexible ionic-liquid thin film battery matrix on FlexTrate™ for powering wearable devices G Ouyang, G Whang, E MacInnis, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1620-1626, 2021 | 8 | 2021 |
| A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils G Ouyang, G Ezhilarasu, H Sun, H Ren, YT Yang, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2266-2271, 2021 | 6 | 2021 |
| Fabrication of Flexible Li-ion Battery Electrodes Using" Battlets" Approach with Ionic Liquid Electrolyte for Powering Wearable Devices G Ouyang, G Whang, E MacInnis, H Ren, H Sun, R Irwin, B Dunn, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 780-785, 2022 | 5 | 2022 |
| Demonstration of a power-efficient and cost-effective power delivery architecture for heterogeneously integrated wafer-scale systems H Ren, K Sahoo, T Xiang, G Ouyang, SS Iyer 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1614-1621, 2023 | 3 | 2023 |
| TrueAdaptTM- AI Based Maskless Patterning to Compensate for Die-Shift in Fan-Out Wafer Level Packaging G Sabbir, K Sahoo, H Sun, S Iyer, G Ouyang, Y Wu 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2240-2246, 2023 | 3 | 2023 |
| Comprehensive investigation of in-plane and out-of-plane die shift in flexible fan-out wafer-level packaging using polydimethylsiloxane G Ouyang, A Hanna, S Benedict, G Ezhilarasu, A Alam, RW Irwin, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 3 | 2022 |
| A Heterogeneously Integrated and Flexible Inorganic Micro-display on FlexTrate™ using Fan-Out Wafer-Level Packaging H Sun, G Ezhilarasu, G Ouyang, R Irwin, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1390-1394, 2022 | 3 | 2022 |
| 3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices G Ouyang, T Fukushima, H Ren, SS Iyer 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 601-605, 2023 | 1 | 2023 |
| TSV-less Power Delivery for Wafer-scale Assemblies and Interposers H Ren, S Pal, G Ouyang, R Irwin, YT Yang, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1934-1939, 2022 | 1 | 2022 |
| Antenna on Silicon Interconnect Fabric A Dasgupta, A Alam, G Ouyang, SC Jangam, SS Iyer 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1788-1794, 2020 | 1 | 2020 |
| Fabrication and Packaging of a Heterogeneously Integrated, Flexible Micro-display and Optical Modeling for Quantum Dot Integration H Sun, H Sonagara, G Ouyang, L Xu, K Ding, M Zhu, C Liu, S Iyer 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2211-2217, 2024 | | 2024 |
| Integration of a Flexible Thin-Film Lithium-Ion Battery with a Wireless Charging System and a Flexible Micro-LED Array G Ouyang, M Sheth, H Sun, SS Iyer 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 164-170, 2024 | | 2024 |
| FlexPower: Integration of Flexible Segmented Li-ion Batteries (Battlet) with Flexible Wireless Charging Technology for Wearable Devices G Ouyang University of California, Los Angeles, 2024 | | 2024 |
| Advanced Packaging Methods Used for Energy Storage from Intermittent Renewable Sources T Fukushima, T Xiang, H Ranjan, N Tripathi, C Liu, G Ouyang, R Irwin, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 444-449, 2023 | | 2023 |
| A thin film and high roughness flexible current collector for high charging/discharging rate flexible Li-ion battery G Ouyang, H Ren, H Sun, SS Iyer 2022 IEEE International Flexible Electronics Technology Conference (IFETC), 1-3, 2022 | | 2022 |
