| Design and performance evaluation of overcurrent protection schemes for silicon carbide (SiC) power MOSFETs Z Wang, X Shi, Y Xue, LM Tolbert, F Wang, BJ Blalock IEEE Transactions on Industrial Electronics 61 (10), 5570-5581, 2014 | 308 | 2014 |
| Temperature-Dependent Short-Circuit Capability of Silicon Carbide Power MOSFETs Z Wang, X Shi, LM Tolbert, F Wang, Z Liang, D Costinett, BJ Blalock IEEE Transactions on Power Electronics 31 (2), 1555-1566, 2016 | 277 | 2016 |
| A di/dt feedback-based active gate driver for smart switching and fast overcurrent protection of IGBT modules Z Wang, X Shi, LM Tolbert, FF Wang, BJ Blalock IEEE Transactions on Power Electronics 29 (7), 3720-3732, 2014 | 266 | 2014 |
| Characteristic investigation and control of a modular multilevel converter-based HVDC system under single-line-to-ground fault conditions X Shi, Z Wang, B Liu, Y Liu, LM Tolbert, F Wang IEEE Transactions on Power Electronics 30 (1), 408-421, 2015 | 193 | 2015 |
| A High-Temperature SiC Three-Phase AC-DC Converter Design for> 100/spl deg/C Ambient Temperature R Wang, D Boroyevich, P Ning, Z Wang, F Wang, P Mattavelli, KDT Ngo, ... IEEE Transactions on Power Electronics 28 (1), 555-572, 2013 | 145 | 2013 |
| A high temperature silicon carbide MOSFET power module with integrated silicon-on-insulator-based gate drive Z Wang, X Shi, LM Tolbert, FF Wang, Z Liang, D Costinett, BJ Blalock IEEE Transactions on Power Electronics 30 (3), 1432-1445, 2015 | 129 | 2015 |
| Active current balancing for parallel-connected silicon carbide MOSFETs Y Xue, J Lu, Z Wang, LM Tolbert, BJ Blalock, F Wang 2013 IEEE Energy Conversion Congress and Exposition, 1563-1569, 2013 | 117 | 2013 |
| A compact planar Rogowski coil current sensor for active current balancing of parallel-connected Silicon Carbide MOSFETs Y Xue, J Lu, Z Wang, LM Tolbert, BJ Blalock, F Wang 2014 IEEE Energy Conversion Congress and Exposition (ECCE), 4685-4690, 2014 | 100 | 2014 |
| A comparison of phase disposition and phase shift PWM strategies for modular multilevel converters X Shi, Z Wang, LM Tolbert, F Wang 2013 IEEE Energy Conversion Congress and Exposition, 4089-4096, 2013 | 100 | 2013 |
| Electrical performance advancement in SiC power module package design with kelvin drain connection and low parasitic inductance F Yang, Z Wang, Z Liang, F Wang IEEE Journal of Emerging and Selected Topics in Power Electronics 7 (1), 84-98, 2018 | 92 | 2018 |
| Modeling, Control Design, and Analysis of a Startup Scheme for Modular Multilevel Converters X Shi, B Liu, Z Wang, Y Li, LM Tolbert, F Wang IEEE Transactions on Industrial Electronics 62 (11), 7009-7024, 2015 | 79 | 2015 |
| Steady-State Modeling of Modular Multilevel Converter Under Unbalanced Grid Conditions X Shi, ZJ Wang, B Liu, Y Li, LM Tolbert, F Wang IEEE Transactions on Power Electronics 32 (9), 7306-7324, 2017 | 75 | 2017 |
| Design of a low parasitic inductance SiC power module with double-sided cooling F Yang, Z Liang, ZJ Wang, F Wang Applied Power Electronics Conference and Exposition (APEC), 2017 IEEE, 3057-3062, 2017 | 67 | 2017 |
| Automated heatsink optimization for air-cooled power semiconductor modules T Wu, Z Wang, B Ozpineci, M Chinthavali, S Campbell IEEE Transactions on Power Electronics 34 (6), 5027-5031, 2018 | 63 | 2018 |
| Active compensation of current unbalance in paralleled silicon carbide MOSFETs Y Xue, J Lu, Z Wang, LM Tolbert, BJ Blalock, F Wang 2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014 …, 2014 | 60 | 2014 |
| Sensitivity analysis of a wireless power transfer (WPT) system for electric vehicle application M Chinthavali, Z Wang IEEE Energy Conversion Congress and Exposition (ECCE), 2016 | 46* | 2016 |
| A fast overcurrent protection scheme for IGBT modules through dynamic fault current evaluation Z Wang, X Shi, LM Tolbert, BJ Blalock, M Chinthavali Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty …, 2013 | 46 | 2013 |
| Analytical modeling of wireless power transfer (WPT) systems for electric vehicle application M Chinthavali, Z Wang, S Campbell IEEE Transportation Electrification Conference and Expo (ITEC), 2016 | 45* | 2016 |
| A 50-kW air-cooled SiC inverter with 3-D printing enabled power module packaging structure and genetic algorithm optimized heatsinks Z Wang, M Chinthavali, SL Campbell, T Wu, B Ozpineci IEEE Transactions on Industry Applications 55 (6), 6256-6265, 2019 | 38 | 2019 |
| Switching performance improvement of IGBT modules using an active gate driver Z Wang, X Shi, LM Tolbert, BJ Blalock Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty …, 2013 | 38 | 2013 |
