Syed M. Alam
Syed M. Alam
Everspin Technologies, Inc.
Verified email at alum.mit.edu - Homepage
TitleCited byYear
Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
AW Topol, DC La Tulipe, L Shi, SM Alam, DJ Frank, SE Steen, J Vichiconti, ...
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International …, 2005
2102005
Three dimensional integrated circuit
SM Alam, IM Elfadel, KW Guarini, M Ieong, PN Kudva, DS Kung, MA Lavin, ...
US Patent 7,312,487, 2007
1862007
Write verify programming of a memory device
T Andre, D Houssameddine, SM Alam, J Slaughter, C Subramanian
US Patent 10,269,405, 2019
167*2019
Power delivery design for 3-D ICs using different through-silicon via (TSV) technologies
NH Khan, SM Alam, S Hassoun
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 19 (4), 647-658, 2010
1392010
A comprehensive layout methodology and layout-specific circuit analyses for three-dimensional integrated circuits
SM Alam, DE Troxel, CV Thompson
Proceedings International Symposium on Quality Electronic Design, 246-251, 2002
1362002
Three dimensional integrated circuit and method of design
SM Alam, IM Elfadel, KW Guarini, M Ieong, PN Kudva, DS Kung, MA Lavin, ...
US Patent 7,723,207, 2010
1342010
Layout-specific circuit evaluation in 3-D integrated circuits
SM Alam, DE Troxel, CV Thompson
Analog Integrated Circuits and Signal Processing 35 (2-3), 199-206, 2003
1202003
A fully functional 64 Mb DDR3 ST-MRAM built on 90 nm CMOS technology
ND Rizzo, D Houssameddine, J Janesky, R Whig, FB Mancoff, ...
IEEE Transactions on Magnetics 49 (7), 4441-4446, 2013
992013
Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits
I Savidis, SM Alam, A Jain, S Pozder, RE Jones, R Chatterjee
Microelectronics Journal 41 (1), 9-16, 2010
862010
Delayed write-back in memory
T Andre, SM Alam, C Subramanian, JS Barkatullah
US Patent 10,268,591, 2019
69*2019
System-level comparison of power delivery design for 2D and 3D ICs
NH Khan, SM Alam, S Hassoun
2009 IEEE International Conference on 3D System Integration, 1-7, 2009
582009
High density ST-MRAM technology
JM Slaughter, ND Rizzo, J Janesky, R Whig, FB Mancoff, ...
Electron Devices Meeting (IEDM), 2012 IEEE International, 29.3. 1-29.3. 4, 2012
562012
Inter-strata connection characteristics and signal transmission in three-dimensional (3D) integration technology
SM Alam, RE Jones, S Rauf, R Chatterjee
Proceedings of the 8th International Symposium on Quality Electronic Design …, 2007
542007
Method of forming a through-substrate via
TG Sparks, SM Alam, R Chatterjee, S Rauf
US Patent App. 11/558,988, 2008
502008
Through-silicon via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs
NH Khan, SM Alam, S Hassoun
2009 IEEE International Conference on 3D System Integration, 1-7, 2009
462009
Low power magnetic quantum cellular automata realization using magnetic multi-layer structures
J Das, SM Alam, S Bhanja
IEEE Journal on Emerging and Selected Topics in Circuits and Systems 1 (3 …, 2011
442011
Circuit level reliability analysis of Cu interconnects
SM Alam, GC Lip, CV Thompson, DE Troxel
Quality Electronic Design, 2004. Proceedings. 5th International Symposium on …, 2004
402004
Ultra-low power hybrid CMOS-magnetic logic architecture
J Das, SM Alam, S Bhanja
IEEE Transactions on Circuits and Systems I: Regular Papers 59 (9), 2008-2016, 2012
392012
Thermal–electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints
A Jain, SM Alam, S Pozder, RE Jones
IET Computers & Digital Techniques 5 (3), 169-178, 2011
302011
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations
SM Alam, CL Gan, CV Thompson, DE Troxel
Microelectronics Journal 38 (4-5), 463-473, 2007
272007
The system can't perform the operation now. Try again later.
Articles 1–20