| Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process L Zhang, P Chen, T An, Y Dai, F Qin Current Applied Physics 19 (5), 570-581, 2019 | 60 | 2019 |
| A lifetime prediction method for IGBT modules considering the self-accelerating effect of bond wire damage F Qin, X Bie, T An, J Dai, Y Dai, P Chen IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (2 …, 2020 | 29 | 2020 |
| Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading Y Dai, M Zhang, F Qin, P Chen, T An Engineering Fracture Mechanics 209, 274-300, 2019 | 26 | 2019 |
| A study on the effect of microstructure evolution of the aluminum metallization layer on its electrical performance during power cycling J Zhao, T An, C Fang, X Bie, F Qin, P Chen, Y Dai IEEE transactions on power electronics 34 (11), 11036-11045, 2019 | 26 | 2019 |
| Vibration lifetime estimation of PBGA solder joints using Steinberg model T An, F Qin, B Zhou, P Chen, Y Dai, H Li, T Tang Microelectronics Reliability 102, 113474, 2019 | 23 | 2019 |
| Characteristics and effects of T-stresses in central-cracked unstiffened and stiffened plates under mode I loading X Huang, Y Liu, Y Dai Engineering Fracture Mechanics 188, 393-415, 2018 | 23 | 2018 |
| Numerical prediction based on XFEM for mixed-mode crack growth path and fatigue life under cyclic overload Z Chen, H Bao, Y Dai, Y Liu International Journal of Fatigue 162, 106943, 2022 | 21 | 2022 |
| On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters S Zhao, Y Dai, F Qin, Y Li, L Liu, Z Zan, T An, P Chen, Y Gong, Y Wang Materials Science and Engineering A, 2021 | 21 | 2021 |
| Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive Y Dai, Z Zan, S Zhao, Y Li, F Qin Engineering Fracture Mechanics 260, 108181, 2022 | 19 | 2022 |
| In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process F Qin, L Zhang, P Chen, T An, Y Dai, Y Gong, Z Yi, H Wang Mechanical Systems and Signal Processing 154, 107550, 2021 | 19 | 2021 |
| Study of warpage evolution and control for six-side molded WLCSP in different packaging processes F Qin, S Zhao, Y Dai, M Yang, M Xiang, D Yu IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 19 | 2020 |
| Higher order asymptotic analysis of crack tip fields under mode II creeping conditions Y Dai, Y Liu, YJ Chao International Journal of Solids and Structures 125, 89-107, 2017 | 19 | 2017 |
| Estimation of stress field for sharp V-notch in power-law creeping solids: An asymptotic viewpoint Y Dai, Y Liu, F Qin, YJ Chao, F Berto International Journal of Solids and Structures 180, 189-204, 2019 | 18 | 2019 |
| Crack arrest behavior of central-cracked stiffened plates under uniform tensions X Huang, Y Liu, X Huang, Y Dai International Journal of Mechanical Sciences 133, 704-719, 2017 | 17 | 2017 |
| Mismatch constraint effect of creep crack with modified boundary layer model Y Dai, D Liu, Y Liu Journal of Applied Mechanics 83 (3), 031008, 2016 | 17 | 2016 |
| Evaluation of thermal conductivity for sintered silver considering aging effect with microstructure based model F Qin, Y Hu, Y Dai, T An, P Chen Microelectronics Reliability 108, 113633, 2020 | 16 | 2020 |
| A unified method to solve higher order asymptotic crack-tip fields of mode I, mode II and mixed mode I/II crack in power-law creeping solids Y Dai, Y Liu, F Qin, YJ Chao Engineering fracture mechanics 218, 106610, 2019 | 15 | 2019 |
| The effect of the surface roughness characteristics of the contact interface on the thermal contact resistance of the PP-IGBT module T An, Z Li, Y Zhang, F Qin, L Wang, Z Lin, X Tang, Y Dai, Y Gong, P Chen IEEE Transactions on Power Electronics 37 (6), 7286-7298, 2021 | 14 | 2021 |
| Constraint modified time dependent failure assessment diagram (TDFAD) based on C (t)-A2 (t) theory for creep crack Y Dai, Y Liu, F Qin, YJ Chao, H Chen International Journal of Mechanical Sciences 165, 105193, 2020 | 14 | 2020 |
| Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints S Zhao, Y Dai, F Qin, Y Li, T An, Y Gong Engineering Fracture Mechanics 264, 108355, 2022 | 13 | 2022 |
Pei Chen (陈沛)Beijing University of Technology （北京工业大学）Verified email at bjut.edu.cn
