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Co-authors
- Congcong WangPh.D student of Materials Science, University of RochesterVerified email at ur.rochester.edu
- Irfan AhmadCoordinator at Alien Tech Transfer; PhD Physics Uo Rochester; Ex Scientist SF Bay AreaVerified email at pas.rochester.edu
- Qifan YanEast China University of Science and TechnologyVerified email at ecust.edu.cn
- Julia ReinspachStanford UniversityVerified email at stanford.edu
- Harald AdeGoodnight Innovation Dist. Prof., North Carolina State UniversityVerified email at ncsu.edu
- Holloway PHDistinguished ProfessorVerified email at mse.ufl.edu
- Krishna AcharyaSavannah River National LaboratoryVerified email at srnl.doe.gov
- Marc RamuzEcole Nationale Supérieure des Mines de Saint-Etienne, CMPVerified email at emse.fr
- Yingpeng Wu美国斯坦福大学化学系Verified email at stanford.edu
- Yi CuiStanford UniversityVerified email at stanford.edu
- Lu Lyu (Lu Lv, 吕路)Technische Universität KaiserslauternVerified email at rhrk.uni-kl.de
- Wei Xia, Ph.D.Samsung Austin Semiconductor; University of Rochester; Chinese Academy of Sciences;Verified email at samsung.com
- Xing Sheng (盛兴)Electronic Engineering, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Ching W. TangInstitute for Advanced Study, Hong Kong University of Science and TechnologyVerified email at rochester.edu
- Cong FuTUV SUD
- Lai WangDepartment of Electronic Engineering, Tsinghua University, 100084 Beijing, ChinaVerified email at tsinghua.edu.cn