| Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds H Xu, C Liu, VV Silberschmidt, SS Pramana, TJ White, Z Chen, VL Acoff Acta Materialia 59 (14), 5661-5673, 2011 | 249 | 2011 |
| A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads H Xu, C Liu, VV Silberschmidt, SS Pramana, TJ White, Z Chen Scripta Materialia 61 (2), 165-168, 2009 | 106 | 2009 |
| Growth of intermetallic compounds in thermosonic copper wire bonding on aluminum metallization H Xu, C Liu, VV Silberschmidt, Z Chen Journal of Electronic materials 39, 124-131, 2010 | 101 | 2010 |
| A micromechanism study of thermosonic gold wire bonding on aluminum pad H Xu, C Liu, VV Silberschmidt, SS Pramana, TJ White, Z Chen, ... Journal of applied physics 108 (11), 2010 | 76 | 2010 |
| Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding H Xu, I Qin, H Clauberg, B Chylak, VL Acoff Acta Materialia 61 (1), 79-88, 2013 | 71 | 2013 |
| Intermetallic phase transformations in Au–Al wire bonds H Xu, C Liu, VV Silberschmidt, SS Pramana, TJ White, Z Chen, VL Acoff Intermetallics 19 (12), 1808-1816, 2011 | 56 | 2011 |
| Wire bonding of Cu and Pd coated Cu wire: bondability, reliability, and IMC formation I Qin, H Xu, H Clauberg, R Cathcart, VL Acoff, B Chylak, C Huynh 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1489-1495, 2011 | 54 | 2011 |
| Effects of process parameters on bondability in thermosonic copper ball bonding H Xu, C Liu, VV Silberschmidt, H Wang 2008 58th Electronic Components and Technology Conference, 1424-1430, 2008 | 41 | 2008 |
| Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution H Xu, C Liu, VV Silberschmidt, Z Chen, J Wei, M Sivakumar Microelectronics Reliability 51 (1), 113-118, 2011 | 39 | 2011 |
| Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5 Ag solder Y Yang, JN Balaraju, SC Chong, H Xu, C Liu, VV Silberschmidt, Z Chen Journal of alloys and compounds 565, 11-16, 2013 | 33 | 2013 |
| New mechanisms of void growth in Au–Al wire bonds: volumetric shrinkage and intermetallic oxidation H Xu, C Liu, VV Silberschmidt, SS Pramana, TJ White, Z Chen, VL Acoff Scripta Materialia 65 (7), 642-645, 2011 | 29 | 2011 |
| New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study H Xu, I Qin, H Clauberg, B Chylak, VL Acoff Scripta Materialia 115, 1-5, 2016 | 27 | 2016 |
| Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads H Xu, C Liu, VV Silberschmidt, Z Chen, J Wei Journal of Materials Processing Technology 210 (8), 1035-1042, 2010 | 25 | 2010 |
| Pd-coated Cu wire bonding technology: Chip design, process optimization, production qualification and reliability test for high reliability semiconductor devices I Singh, I Qin, H Xu, C Huynh, S Low, H Clauberg, B Chylak, VL Acoff 2012 IEEE 62nd Electronic Components and Technology Conference, 1089-1096, 2012 | 20 | 2012 |
| Effect of ultrasonic energy on nanoscale interfacial structure in copper wire bonding on aluminium pads H Xu, C Liu, VV Silberschmidt, Z Chen, VL Acoff Journal of Physics D: Applied Physics 44 (14), 145301, 2011 | 19 | 2011 |
| Molded reliability study for different Cu wire bonding configurations I Qin, H Xu, B Milton, H Clauberg, B Chylak, H Abe, D Kang, Y Endo, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 1587-1594, 2013 | 16 | 2013 |
| The role of bonding duration in wire bond formation: a study of footprints of thermosonic gold wire on aluminium pad H Xu, C Liu, VV Silberschmidt, Z Chen, J Wei Microelectronics International 27 (1), 11-16, 2010 | 16 | 2010 |
| Microtexture development of niobium in a multilayered Ti/Al/Nb composite produced by accumulative roll bonding P Qu, L Zhou, H Xu, VL Acoff Metallurgical and Materials Transactions A 45, 6217-6230, 2014 | 15 | 2014 |
| Process optimization and reliability study for Cu wire bonding advanced nodes I Qin, H Xu, B Milton, N Mendoza, H Clauberg, B Chylak, H Abe, D Kang, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1523-1528, 2014 | 14 | 2014 |
| Facilitating intermetallic formation in wire bonding by applying a pre-ultrasonic energy H Xu, VL Acoff, C Liu, VV Silberschmidt, Z Chen Microelectronic engineering 88 (10), 3155-3157, 2011 | 14 | 2011 |
Professor Vadim V. SilberschmidtProfessor of Mechanics of Materials, Loughborough UniversityVahvistettu sähköpostiosoite verkkotunnuksessa lboro.ac.uk
