Design of a high-efficiency, high specific-power three-level T-type power electronics building block for aircraft electric-propulsion drives A Deshpande, Y Chen, B Narayanasamy, Z Yuan, C Chen, F Luo IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 407-416, 2019 | 75 | 2019 |
Hardware design of a 1.7 kV SiC MOSFET based MMC for medium voltage motor drives H Li, K Potty, Z Ke, J Pan, Y Chen, F Zhang, M Al Sabbagh, W Perdikakis, ... 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 1649-1655, 2018 | 54 | 2018 |
A model-based multi-objective optimization for high efficiency and high power density motor drive inverters for aircraft applications Y Chen, Z Yuan, F Luo NAECON 2018-IEEE National Aerospace and Electronics Conference, 36-42, 2018 | 38 | 2018 |
A three-level, T-type, power electronics building block using Si-SiC hybrid switch for high-speed drives A Deshpande, Y Chen, B Narayanasamy, AS Sathyanarayanan, F Luo 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 2609-2616, 2018 | 31 | 2018 |
DC-DC modular multilevel converter with high frequency transformer for transportation applications Y Cui, Y Chen, Y Chen, Y Kang, X Wei, X Wang 2014 IEEE Conference and Expo Transportation Electrification Asia-Pacific …, 2014 | 19 | 2014 |
Modular three-level T-type power electronics building block for aircraft electric-propulsion drives A Deshpande, Y Chen, B Narayanasamy, Z Yuan, F Luo 2020 AIAA/IEEE Electric Aircraft Technologies Symposium (EATS), 1-8, 2020 | 14 | 2020 |
Packaging and integration of DBC-based SiC hybrid power module in 379W/in3 DC/DC converter T Liu, Y Xie, Y Li, C Chen, Y Kang, L Peng, Y Chen, F Luo 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE …, 2017 | 5 | 2017 |
Comprehensive evaluation of interleaved zero current switching inverter against interleaved hard switching inverters in terms of efficiency, power density and EMI spectrum Y Chen, AS Sathyanarayanan, B Narayanasamy, W Feng, F Luo 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 2253-2258, 2017 | 4 | 2017 |